Inventor · disambiguated record
Ho-Sik Park
Also filed as: PARK HO · PARK HO SIK · PARK HO SIK (HANS)
11 granted patents·17 pending applications·29 citations·filing 2008–2025
86Inventor score
Files withSAMSUNG ELECTRO MECH13PARK HO-SIK3SOHN KEUNG JIN2AT & S AUSTRIA TECH & SYSTEMTECHNIK AG1AUSTRIA TECH & SYSTEM TECH1
Top patents by PatentIndex Score
28 records- 0187US7893527B2Semiconductor plastic package and fabricating method thereofSAMSUNG ELECTRO MECH·Filed 2008·Granted Feb 22, 2011·14 cites·11 claims
- 0278US10779414B2Electronic component embedded printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Sep 15, 2020·3 cites·13 claims
- 0378US10529476B2Coil component and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2017·Granted Jan 7, 2020·1 cites·12 claims
- 0477US8647926B2Method of fabricating semiconductor plastic package including a core board, build-up insulation layer, printed circuit, and semiconductor chipSHIN JOON-SIK·Filed 2010·Granted Feb 11, 2014·4 cites·15 claims
- 0564US2025273593A1Component Carrier With Cavity and Laser Protection StructureAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2025·Application pending·0 cites
- 0663US8499441B2Method of manufacturing a printed circuit boardPARK JUNG-HWAN·Filed 2008·Granted Aug 6, 2013·2 cites·12 claims
- 0762US8356405B2Method of manufacturing printed circuit boardSAMSUNG ELECTRO MECH·Filed 2010·Granted Jan 22, 2013·2 cites·16 claims
- 0860US8397378B2Manufacturing an insulating sheet, a copper clad laminate, and a printed circuit boardSOHN KEUNG-JIN·Filed 2008·Granted Mar 19, 2013·2 cites·15 claims
- 0958US2009236038A1Method for manufacturing insulating sheet and method for manufacturing metal clad laminate and printed circuit board using the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1056US8997340B2Method of manufacturing and insulating sheetSOHN KEUNGJIN·Filed 2011·Granted Apr 7, 2015·1 cites·22 claims
- 1155US2009250253A1Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1253US2012012379A1Printed circuit boardPARK HO-SIK·Filed 2011·Application pending·0 cites
- 1353US2012030938A1Method of manufacturing printed circuit boardPARK HO-SIK·Filed 2011·Application pending·0 cites
- 1453US2012018195A1Printed circuit boardPARK HO-SIK·Filed 2011·Application pending·0 cites
- 1551US2025285925A1Component Carrier and Method of Manufacturing the SameAUSTRIA TECH & SYSTEM TECH·Filed 2025·Application pending·0 cites
- 1650US2011139499A1Printed circuit board and manufacturing method of the sameSAMSUNG ELECTRO MECH·Filed 2011·Application pending·0 cites
- 1750US2009242248A1Insulating sheet and printed circuit board having the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1849US8450618B2Printed circuit board with reinforced thermoplastic resin layerSOHN KEUNG-JIN·Filed 2011·Granted May 28, 2013·0 cites·4 claims
- 1948US2009288293A1Metal core package substrate and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 2045US2022249736A1Foraminifera-derived bone graft materialKIM BEOM SU·Filed 2020·Application pending·0 cites
- 2145US2014174793A1Printed circuit board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2243US9674944B2Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2016·Granted Jun 6, 2017·0 cites·17 claims
- 2342US2012261166A1Printed circuit board and method of manufacturing the sameOH CHANG GUN·Filed 2011·Application pending·0 cites
- 2442US2015351219A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 2538US2018137975A1Thin film-type inductor and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2017·Application pending·0 cites
- 2635US2012152753A1Method of manufacturing printed circuit boardLEE SUK WON·Filed 2011·Application pending·0 cites
- 2733US8720049B2Printed circuit board and method for fabricating the sameBAE TAE KYUN·Filed 2011·Granted May 13, 2014·0 cites·7 claims
- 2827US2013079223A1Method for preparing mesoporous carbon having iron oxide nanoparticlesKIM YO-HAN·Filed 2011·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →