Inventor · disambiguated record
Motohiko Sugiura
Also filed as: SUGIURA MOTOHIKO
7 granted patents·8 pending applications·3 citations·filing 2015–2023
71Inventor score
Files withSUMITOMO ELECTRIC INDUSTRIES15
Top patents by PatentIndex Score
15 records- 0180US10610928B2Powder for conductive material, ink for conductive material, conductive paste, and method for producing powder for conductive materialSUMITOMO ELECTRIC INDUSTRIES·Filed 2016·Granted Apr 7, 2020·1 cites·4 claims
- 0278US10143083B2Substrate for printed circuit board and method for producing substrate for printed circuit boardSUMITOMO ELECTRIC INDUSTRIES·Filed 2015·Granted Nov 27, 2018·2 cites·7 claims
- 0363US12213249B2Method for manufacturing dielectric sheet, method for manufacturing substrate for high-frequency printed wiring board, dielectric sheet, and substrate for high-frequency printed wiring boardSUMITOMO ELECTRIC INDUSTRIES·Filed 2021·Granted Jan 28, 2025·0 cites·9 claims
- 0455US11013113B2Base material for printed circuit board and printed circuit boardSUMITOMO ELECTRIC INDUSTRIES·Filed 2018·Granted May 18, 2021·0 cites·8 claims
- 0553US2025365861A1Substrate for printed circuit board and printed circuit boardSUMITOMO ELECTRIC INDUSTRIES·Filed 2023·Application pending·0 cites
- 0652US11752734B2Base material for printed circuit board and printed circuit boardSUMITOMO ELECTRIC INDUSTRIES·Filed 2018·Granted Sep 12, 2023·0 cites·7 claims
- 0752US10796812B2Coating liquid for forming conductive layer, method for producing conductive layer, and conductive layerSUMITOMO ELECTRIC INDUSTRIES·Filed 2017·Granted Oct 6, 2020·0 cites·7 claims
- 0850US11465208B2Method of manufacturing copper nano-ink and copper nano-inkSUMITOMO ELECTRIC INDUSTRIES·Filed 2018·Granted Oct 11, 2022·0 cites·1 claims
- 0950US2024422902A1Dielectric sheet, substrate for high frequency printed wiring board, and high frequency printed wiring boardSUMITOMO ELECTRIC INDUSTRIES·Filed 2022·Application pending·0 cites
- 1047US2020245458A1Base material for printed circuit board and printed circuit boardSUMITOMO ELECTRIC INDUSTRIES·Filed 2018·Application pending·0 cites
- 1143US2018315519A1Coating liquid for forming conductive layer and method for manufacturing conductive layerSUMITOMO ELECTRIC INDUSTRIES·Filed 2016·Application pending·0 cites
- 1243US2018305829A1Method for manufacturing titanium trichloride solution and device for manufacturing titanium trichloride solutionSUMITOMO ELECTRIC INDUSTRIES·Filed 2016·Application pending·0 cites
- 1341US2021127487A1Base material for printed circuit board and printed circuit boardSUMITOMO ELECTRIC INDUSTRIES·Filed 2019·Application pending·0 cites
- 1440US2020344890A1Method of manufacturing substrate for printed circuit boardSUMITOMO ELECTRIC INDUSTRIES·Filed 2018·Application pending·0 cites
- 1538US2017213615A1Metal nanoparticle dispersion and metal coating filmSUMITOMO ELECTRIC INDUSTRIES·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →