Inventor · disambiguated record
Ron Boja
Also filed as: BOJA RON
3 granted patents·1 pending application·4 citations·filing 2012–2013
56Inventor score
Files withNVIDIA CORP4
Top patents by PatentIndex Score
4 records- 0170US9716051B2Open solder mask and or dielectric to increase lid or ring thickness and contact area to improve package coplanarityNVIDIA CORP·Filed 2012·Granted Jul 25, 2017·2 cites·20 claims
- 0265US9368422B2Absorbing excess under-fill flow with a solder trenchNVIDIA CORP·Filed 2012·Granted Jun 14, 2016·2 cites·15 claims
- 0344US9760132B2Stiffening electronic packages by disposing a stiffener ring between substrate center area and conductive padNVIDIA CORP·Filed 2013·Granted Sep 12, 2017·0 cites·30 claims
- 0439US2014124254A1Non-solder mask defined copper pad and embedded copper pad to reduce packaging system heightNVIDIA CORP·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →