Inventor · disambiguated record
Mario J. Interrante
Also filed as: INTERRANTE MARIO · INTERRANTE MARIO J · INTERRANTE MARIO JOHN
47 granted patents·8 pending applications·1,139 citations·filing 1981–2021
98Inventor score
Top patents by PatentIndex Score
55 records- 0193US6283359B1Method for enhancing fatigue life of ball grid arraysIBM·Filed 2000·Granted Sep 4, 2001·53 cites·5 claims
- 0292US9860996B2Selective area heating for 3D chip stackIBM·Filed 2016·Granted Jan 2, 2018·6 cites·12 claims
- 0392US9373590B1Integrated circuit bonding with interposer dieIBM·Filed 2014·Granted Jun 21, 2016·9 cites·20 claims
- 0492US6740959B2EMI shielding for semiconductor chip carriersIBM·Filed 2001·Granted May 25, 2004·97 cites·28 claims
- 0592US5990418AHermetic CBGA/CCGA structure with thermal paste coolingIBM·Filed 1997·Granted Nov 23, 1999·156 cites·19 claims
- 0688US10262970B2Selective area heating for 3D chip stackIBM·Filed 2016·Granted Apr 16, 2019·4 cites·5 claims
- 0788US9105629B2Selective area heating for 3D chip stackIBM·Filed 2013·Granted Aug 11, 2015·6 cites·15 claims
- 0888US6532654B2Method of forming an electrical connectorIBM·Filed 2001·Granted Mar 18, 2003·38 cites·24 claims
- 0988US6458623B1Conductive adhesive interconnection with insulating polymer carrierIBM·Filed 2001·Granted Oct 1, 2002·45 cites·29 claims
- 1088US6429388B1High density column grid array connections and method thereofIBM·Filed 2000·Granted Aug 6, 2002·53 cites·14 claims
- 1187US9431366B2Selective area heating for 3D chip stackIBM·Filed 2015·Granted Aug 30, 2016·4 cites·19 claims
- 1287US6287126B1Mechanical attachment means used as electrical connectionIBM·Filed 1999·Granted Sep 11, 2001·58 cites·48 claims
- 1384US6235996B1Interconnection structure and process module assembly and reworkIBM·Filed 1998·Granted May 22, 2001·65 cites·35 claims
- 1482US8689437B2Method for forming integrated circuit assemblyDANG BING·Filed 2009·Granted Apr 8, 2014·11 cites·20 claims
- 1582US6518674B2Temporary attach article and method for temporary attach of devices to a substrateIBM·Filed 2001·Granted Feb 11, 2003·23 cites·7 claims
- 1682US6158644AMethod for enhancing fatigue life of ball grid arraysIBM·Filed 1998·Granted Dec 12, 2000·43 cites·9 claims
- 1781US6892925B2Solder hierarchy for lead free solder jointIBM·Filed 2002·Granted May 17, 2005·28 cites·16 claims
- 1881US6854636B2Structure and method for lead free solder electronic package interconnectionsIBM·Filed 2002·Granted Feb 15, 2005·20 cites·14 claims
- 1976US6762119B2Method of preventing solder wetting in an optical device using diffusion of CrINTERNAT BUSSINESS MACHINES CO·Filed 2001·Granted Jul 13, 2004·23 cites·18 claims
- 2075US7781232B2Method to recover underfilled modules by selective removal of discrete componentsIBM·Filed 2008·Granted Aug 24, 2010·6 cites·20 claims
- 2174US11810893B2Silicon interposer sandwich structure for ESD, EMC, and EMC shielding and protectionIBM·Filed 2021·Granted Nov 7, 2023·0 cites·1 claims
- 2274US11049841B2Silicon interposer sandwich structure for ESD, EMC, and EMC shielding and protectionIBM·Filed 2017·Granted Jun 29, 2021·1 cites·3 claims
- 2374US6574859B2Interconnection process for module assembly and reworkIBM·Filed 2001·Granted Jun 10, 2003·18 cites·25 claims
- 2472US5193732AApparatus and methods for making simultaneous electrical connectionsIBM·Filed 1991·Granted Mar 16, 1993·49 cites·13 claims
- 2570US6259155B1Polymer enhanced column grid arrayIBM·Filed 1999·Granted Jul 10, 2001·31 cites·22 claims
- 2668US6216937B1Process and apparatus to remove closely spaced chips on a multi-chip moduleIBM·Filed 1999·Granted Apr 17, 2001·31 cites·12 claims
- 2768US5153408AMethod and structure for repairing electrical linesIBM·Filed 1990·Granted Oct 6, 1992·33 cites·44 claims
- 2867US6360938B2Process and apparatus to remove closely spaced chips on a multi-chip moduleIBM·Filed 2001·Granted Mar 26, 2002·12 cites·12 claims
- 2964US5243140ADirect distribution repair and engineering change systemIBM·Filed 1991·Granted Sep 7, 1993·33 cites·13 claims
- 3063US8614512B2Solder ball contact susceptible to lower stressGUERIN LUC·Filed 2012·Granted Dec 24, 2013·2 cites·18 claims
- 3162US5425493ASelective addition of a solder ball to an array of solder ballsIBM·Filed 1994·Granted Jun 20, 1995·19 cites·8 claims
- 3262US5288007AApparatus and methods for making simultaneous electrical connectionsIBM·Filed 1992·Granted Feb 22, 1994·33 cites·19 claims
- 3361US9059241B23D assembly for interposer bowIBM·Filed 2013·Granted Jun 16, 2015·1 cites·10 claims
- 3460US8487447B2Semiconductor structure having offset passivation to reduce electromigrationINTERRANTE MARIO J·Filed 2011·Granted Jul 16, 2013·2 cites·16 claims
- 3560US2018350768A1Silicon Interposer Sndwich Structure for ESD, EMI, and EMC Shielding and ProtectionIBM·Filed 2018·Application pending·0 cites
- 3659US10903187B2Selective area heating for 3D chip stackIBM·Filed 2017·Granted Jan 26, 2021·0 cites·8 claims
- 3758US4634638AHigh melting point copper-gold-tin brazing alloy for chip carriersIBM·Filed 1981·Granted Jan 6, 1987·19 cites·8 claims
- 3857US6917113B2Lead-free alloys for column/ball grid arrays, organic interposers and passive component assemblyIBM·Filed 2003·Granted Jul 12, 2005·7 cites·53 claims
- 3956US6497357B2Apparatus and method for removing interconnectionsIBM·Filed 2001·Granted Dec 24, 2002·8 cites·15 claims
- 4056US5945735AHermetic sealing of a substrate of high thermal conductivity using an interposer of low thermal conductivityIBM·Filed 1997·Granted Aug 31, 1999·21 cites·15 claims
- 4156US5543584AStructure for repairing electrical linesIBM·Filed 1992·Granted Aug 6, 1996·21 cites·24 claims
- 4255US2016233190A1Silicon Interposer Sndwich Structure for ESD, EMI, and EMC Shielding and ProtectionIBM·Filed 2016·Application pending·0 cites
- 4354US5478009ASelective removal of a single solder ball from an array of solder ballsIBM·Filed 1994·Granted Dec 26, 1995·14 cites·7 claims
- 4453US6302732B1Coaxial connection apparatus and method of attachmentIBM·Filed 1999·Granted Oct 16, 2001·14 cites·15 claims
- 4550US6827505B2Optoelectronic package structure and process for planar passive optical and optoelectronic devicesIBM·Filed 2002·Granted Dec 7, 2004·4 cites·20 claims
- 4650US6037193AHermetic sealing of a substrate of high thermal conductivity using an interposer of low thermal conductivityIBM·Filed 1997·Granted Mar 14, 2000·16 cites·15 claims
- 4750US2013082365A1Interposer for ESD, EMI, and EMCBERNIER WILLIAM E·Filed 2011·Application pending·0 cites
- 4848US2007158395A1Method for preparing and assembling a soldered substrateIBM·Filed 2006·Application pending·0 cites
- 4948US2009085202A1Methods and Apparatus for Assembling Integrated Circuit Device Utilizing a Thin Si InterposerDANG BING·Filed 2007·Application pending·0 cites
- 5046US9224712B23D bond and assembly process for severely bowed interposer dieIBM·Filed 2014·Granted Dec 29, 2015·0 cites·19 claims
Showing the top 50 of 55 patent records by PatentIndex Score.
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