Inventor · disambiguated record
Nobuyuki Ikeguchi
Also filed as: IKEGUCHI NOBUYUKI
46 granted patents·10 pending applications·1,463 citations·filing 1979–2012
99Inventor score
Files withMITSUBISHI GAS CHEMICAL CO40SAMSUNG ELECTRO MECH6IKEGUCHI NOBUYUKI3GAKU MORIO1SHIN JOON-SIK1
Top patents by PatentIndex Score
56 records- 0197US6280641B1Printed wiring board having highly reliably via hole and process for forming via holeMITSUBISHI GAS CHEMICAL CO·Filed 1999·Granted Aug 28, 2001·147 cites·16 claims
- 0295US6720651B2Semiconductor plastic package and process for the production thereofMITSUBISHI GAS CHEMICAL CO·Filed 2002·Granted Apr 13, 2004·96 cites·8 claims
- 0395US6097089ASemiconductor plastic package, metal plate for said package, and method of producing copper-clad board for said packageMITSUBISHI GAS CHEMICAL CO·Filed 1999·Granted Aug 1, 2000·121 cites·11 claims
- 0492US4552690AElectrically conductive resin compositionMITSUBISHI GAS CHEMICAL CO·Filed 1984·Granted Nov 12, 1985·50 cites·8 claims
- 0591US6562179B1High relative-permittivity B-staged sheet, high relative-permittivity prepreg, its production process, and printed wiring board comprising any one of theseMITSUBISHI GAS CHEMICAL CO·Filed 2000·Granted May 13, 2003·41 cites·7 claims
- 0690US6396143B1Ball grid array type printed wiring board having exellent heat diffusibility and printed wiring boardMITSUBISHI GAS CHEMICAL CO·Filed 2000·Granted May 28, 2002·68 cites·3 claims
- 0789US4383903ACurable resin compositionMITSUBISHI GAS CHEMICAL CO·Filed 1981·Granted May 17, 1983·55 cites·7 claims
- 0889US4371689ACurable resin composition comprising cyanate ester and acrylic alkenyl esterMITSUBISHI GAS CHEMICAL CO·Filed 1980·Granted Feb 1, 1983·43 cites·10 claims
- 0988US6736988B1Copper-clad board suitable for making hole with carbon dioxide laser, method of making hole in said copper-clad board and printed wiring board comprising said copper-clad boardMITSUBISHI GAS CHEMICAL CO·Filed 2000·Granted May 18, 2004·31 cites·5 claims
- 1088US6376908B1Semiconductor plastic package and process for the production thereofMITSUBISHI GAS CHEMICAL CO·Filed 1998·Granted Apr 23, 2002·85 cites·5 claims
- 1188US6362436B1Printed wiring board for semiconductor plastic packageMITSUBISHI GAS CHEMICAL CO·Filed 2000·Granted Mar 26, 2002·49 cites·7 claims
- 1288US4393195ACurable cyanate ester/acrylic epoxy ester compositionMITSUBISHI GAS CHEMICAL CO·Filed 1980·Granted Jul 12, 1983·44 cites·8 claims
- 1387US7893527B2Semiconductor plastic package and fabricating method thereofSAMSUNG ELECTRO MECH·Filed 2008·Granted Feb 22, 2011·14 cites·11 claims
- 1487US6265767B1Semiconductor plastic package, metal plate for said package, and method of producing copper-clad board for said packageMITSUBISHI GAS CHEMICAL CO·Filed 2000·Granted Jul 24, 2001·44 cites·7 claims
- 1587US4396745ACurable resin compositionMITSUBISHI GAS CHEMICAL CO·Filed 1981·Granted Aug 2, 1983·36 cites·9 claims
- 1685US4370467ACurable resin composition from polyfunctional aromatic ester and maleimide compoundMITSUBISHI GAS CHEMICAL CO·Filed 1980·Granted Jan 25, 1983·37 cites·9 claims
- 1782US4404330ACurable resin compositionMITSUBISHI GAS CHEMICAL CO·Filed 1981·Granted Sep 13, 1983·26 cites·13 claims
- 1881US6708404B1Method of producing high-density copper clad multi-layered printed wiring board having highly reliable through holeMITSUBISHI GAS CHEMICAL CO·Filed 2000·Granted Mar 23, 2004·33 cites·7 claims
- 1981US6479760B2Printed wiring board for semiconductor plastic packageMITSUBISHI GAS CHEMICAL CO·Filed 2001·Granted Nov 12, 2002·28 cites·7 claims
- 2080US4330669ACurable resin compositionMITSUBISHI GAS CHEMICAL CO·Filed 1980·Granted May 18, 1982·34 cites·9 claims
- 2178US8174128B2Method of manufacturing semiconductor package having a first board, second boards electrically connected to both sides of the first board, and at least one component connected to the first board by a flip chip methodIKEGUCHI NOBUYUKI·Filed 2010·Granted May 8, 2012·5 cites·18 claims
- 2278US4373086ACurable resin composition from cyanate ester and acrylic esterMITSUBISHI GAS CHEMICAL CO·Filed 1981·Granted Feb 8, 1983·26 cites·10 claims
- 2377US8647926B2Method of fabricating semiconductor plastic package including a core board, build-up insulation layer, printed circuit, and semiconductor chipSHIN JOON-SIK·Filed 2010·Granted Feb 11, 2014·4 cites·15 claims
- 2477US6866919B2Heat-resistant film base-material-inserted B-stage resin composition sheet for lamination and use thereofMITSUBISHI GAS CHEMICAL CO·Filed 2003·Granted Mar 15, 2005·29 cites·11 claims
- 2576US6350952B1Semiconductor package including heat diffusion portionMITSUBISHI GAS CHEMICAL CO·Filed 1999·Granted Feb 26, 2002·51 cites·23 claims
- 2675US6337463B1Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making holeMITSUBISHI GAS CHEMICAL CO·Filed 1999·Granted Jan 8, 2002·28 cites·10 claims
- 2775US4403073ACurable resin compositionMITSUBISHI GAS CHEMICAL CO·Filed 1981·Granted Sep 6, 1983·18 cites·13 claims
- 2875US4396679APlastic articles suitable for electroless platingMITSUBISHI GAS CHEMICAL CO·Filed 1981·Granted Aug 2, 1983·30 cites·13 claims
- 2975US4369304ACurable resin composition of (1) polyfunctional cyanate ester, (2) acrylic or methacrylic ester and (3) maleimideMITSUBISHI GAS CHEMICAL CO·Filed 1980·Granted Jan 18, 1983·27 cites·3 claims
- 3075US4330658ACurable resin compositionMITSUBISHI GAS CHEMICAL CO·Filed 1980·Granted May 18, 1982·24 cites·9 claims
- 3174US4369302ACurable resin composition comprising cyanate ester and polyisocyanateMITSUBISHI GAS CHEMICAL CO·Filed 1980·Granted Jan 18, 1983·24 cites·11 claims
- 3273US9211592B2Lubricant sheet for drilling and method of drillingIKEGUCHI NOBUYUKI·Filed 2008·Granted Dec 15, 2015·2 cites·10 claims
- 3369US8377544B2Glass fabric base material/thermosetting resin copper-clad laminate having a high-elasticityMITSUBISHI GAS CHEMICAL CO·Filed 2010·Granted Feb 19, 2013·1 cites·2 claims
- 3469US6528552B1Resist composition excellent in flame resistanceMITSUBISHI GAS CHEMICAL CO·Filed 2001·Granted Mar 4, 2003·17 cites·8 claims
- 3568US4469859ACurable resin composition comprising cyanate ester and cyclopentadieneMITSUBISHI GAS CHEMICAL CO·Filed 1980·Granted Sep 4, 1984·19 cites·8 claims
- 3665US6750422B2Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making holeMITSUBISHI GAS CHEMICAL CO·Filed 2001·Granted Jun 15, 2004·8 cites·6 claims
- 3763US8030752B2Method of manufacturing semiconductor package and semiconductor plastic package using the sameSAMSUNG ELECTRO MECH·Filed 2008·Granted Oct 4, 2011·2 cites·19 claims
- 3861US4645805AAdhesive composition and adhesive film or sheet on which the composition is coatedMITSUBISHI GAS CHEMICAL CO·Filed 1985·Granted Feb 24, 1987·20 cites·7 claims
- 3961US4499245ACurable resin compositionMITSUBISHI GAS CHEMICAL CO·Filed 1983·Granted Feb 12, 1985·12 cites·3 claims
- 4058US2009236038A1Method for manufacturing insulating sheet and method for manufacturing metal clad laminate and printed circuit board using the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 4156US8997340B2Method of manufacturing and insulating sheetSOHN KEUNGJIN·Filed 2011·Granted Apr 7, 2015·1 cites·22 claims
- 4255US2005003169A1Lubricant sheet for drilling and method of drillingFiled 2004·Application pending·0 cites
- 4350US2009242248A1Insulating sheet and printed circuit board having the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 4449US6680152B2Photosensitive resin compositionMITSUBISHI GAS CHEMICAL CO·Filed 2002·Granted Jan 20, 2004·2 cites·12 claims
- 4549US4717609AAdhesive composition and adhesive film or sheet on which the composition is coatedMITSUBISHI GAS CHEMICAL CO·Filed 1986·Granted Jan 5, 1988·13 cites·7 claims
- 4648US2006089070A1Glass fabric base material/thermosetting resin copper-clad laminate having a high-elasticityGAKU MORIO·Filed 2005·Application pending·0 cites
- 4748US2009159318A1Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 4847US2009008136A1Multilayered printed circuit board and fabricating method thereofSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 4944US4370462ACurable resin compositionMITSUBISHI GAS CHEMICAL CO·Filed 1979·Granted Jan 25, 1983·6 cites·4 claims
- 5044US2012174393A1Method of fabricating multilayered printed circuit boardIKEGUCHI NOBUYUKI·Filed 2012·Application pending·0 cites
Showing the top 50 of 56 patent records by PatentIndex Score.
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