Inventor · disambiguated record
Morio Gaku
Also filed as: GAKU MORIO
47 granted patents·4 pending applications·1,780 citations·filing 1974–2010
99Inventor score
Top patents by PatentIndex Score
51 records- 0197US6280641B1Printed wiring board having highly reliably via hole and process for forming via holeMITSUBISHI GAS CHEMICAL CO·Filed 1999·Granted Aug 28, 2001·147 cites·16 claims
- 0296US4110364ACurable resin compositions of cyanate estersMITSUBISHI GAS CHEMICAL CO·Filed 1975·Granted Aug 29, 1978·132 cites·11 claims
- 0395US6720651B2Semiconductor plastic package and process for the production thereofMITSUBISHI GAS CHEMICAL CO·Filed 2002·Granted Apr 13, 2004·96 cites·8 claims
- 0495US6097089ASemiconductor plastic package, metal plate for said package, and method of producing copper-clad board for said packageMITSUBISHI GAS CHEMICAL CO·Filed 1999·Granted Aug 1, 2000·121 cites·11 claims
- 0592US4917758AMethod for preparing thin copper foil-clad substrate for circuit boardsMITSUBISHI GAS CHEMICAL CO·Filed 1989·Granted Apr 17, 1990·61 cites·16 claims
- 0691US4026913ACyanic acid esters of aromatic polycarbonatesMITSUBISHI GAS CHEMICAL CO·Filed 1976·Granted May 31, 1977·53 cites·19 claims
- 0789US4383903ACurable resin compositionMITSUBISHI GAS CHEMICAL CO·Filed 1981·Granted May 17, 1983·55 cites·7 claims
- 0889US4371689ACurable resin composition comprising cyanate ester and acrylic alkenyl esterMITSUBISHI GAS CHEMICAL CO·Filed 1980·Granted Feb 1, 1983·43 cites·10 claims
- 0988US6736988B1Copper-clad board suitable for making hole with carbon dioxide laser, method of making hole in said copper-clad board and printed wiring board comprising said copper-clad boardMITSUBISHI GAS CHEMICAL CO·Filed 2000·Granted May 18, 2004·31 cites·5 claims
- 1088US6376908B1Semiconductor plastic package and process for the production thereofMITSUBISHI GAS CHEMICAL CO·Filed 1998·Granted Apr 23, 2002·85 cites·5 claims
- 1188US4904760AThermosetting resin composition from cyanate ester and non-branched aromatic compoundMITSUBISHI GAS CHEMICAL CO·Filed 1988·Granted Feb 27, 1990·57 cites·10 claims
- 1288US4393195ACurable cyanate ester/acrylic epoxy ester compositionMITSUBISHI GAS CHEMICAL CO·Filed 1980·Granted Jul 12, 1983·44 cites·8 claims
- 1387US6265767B1Semiconductor plastic package, metal plate for said package, and method of producing copper-clad board for said packageMITSUBISHI GAS CHEMICAL CO·Filed 2000·Granted Jul 24, 2001·44 cites·7 claims
- 1486US3962184AProcess for preparing cured resin from cyanic acid esters using imidazole catalystsMITSUBISHI GAS CHEMICAL CO·Filed 1974·Granted Jun 8, 1976·36 cites·4 claims
- 1585US4370467ACurable resin composition from polyfunctional aromatic ester and maleimide compoundMITSUBISHI GAS CHEMICAL CO·Filed 1980·Granted Jan 25, 1983·37 cites·9 claims
- 1685US3932250AMethod for manufacturing metal foil- or plastic film-overlaid laminateMITSUBISHI GAS CHEMICAL CO·Filed 1974·Granted Jan 13, 1976·46 cites·16 claims
- 1782US5082402AMethod of drilling of through-holes in printed circuit board panelsMITSUBISHI GAS CHEMICAL CO·Filed 1991·Granted Jan 21, 1992·50 cites·5 claims
- 1881US6708404B1Method of producing high-density copper clad multi-layered printed wiring board having highly reliable through holeMITSUBISHI GAS CHEMICAL CO·Filed 2000·Granted Mar 23, 2004·33 cites·7 claims
- 1980US4871811AHot melt adhesive compositionMITSUBISHI GAS CHEMICAL CO·Filed 1988·Granted Oct 3, 1989·40 cites·7 claims
- 2079US4937132ALaminating material for printed circuit board of low dielectric constantMITSUBISHI GAS CHEMICAL CO·Filed 1988·Granted Jun 26, 1990·35 cites·18 claims
- 2177US4287014ANovel crosslinkable resin composition and method for producing a laminate using said compositionMITSUBISHI GAS CHEMICAL CO·Filed 1979·Granted Sep 1, 1981·44 cites·6 claims
- 2276US6350952B1Semiconductor package including heat diffusion portionMITSUBISHI GAS CHEMICAL CO·Filed 1999·Granted Feb 26, 2002·51 cites·23 claims
- 2376US4820769AHot melt adhesive compositionMITSUBISHI GAS CHEMICAL CO·Filed 1987·Granted Apr 11, 1989·21 cites·5 claims
- 2476US4780507ACurable thermosetting cyanate ester compositionMITSUBISHI GAS CHEMICAL CO·Filed 1986·Granted Oct 25, 1988·38 cites·9 claims
- 2576US4740343AMethod for producing rigid resin moldsMITSUBISHI GAS CHEMICAL CO·Filed 1987·Granted Apr 26, 1988·37 cites·6 claims
- 2676US4533727AProcess for producing a curable resin from cyanate ester compound and unsaturated 1,2-epoxy compoundMITSUBISHI GAS CHEMICAL CO·Filed 1984·Granted Aug 6, 1985·22 cites·8 claims
- 2775US6337463B1Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making holeMITSUBISHI GAS CHEMICAL CO·Filed 1999·Granted Jan 8, 2002·28 cites·10 claims
- 2875US4396679APlastic articles suitable for electroless platingMITSUBISHI GAS CHEMICAL CO·Filed 1981·Granted Aug 2, 1983·30 cites·13 claims
- 2975US4369304ACurable resin composition of (1) polyfunctional cyanate ester, (2) acrylic or methacrylic ester and (3) maleimideMITSUBISHI GAS CHEMICAL CO·Filed 1980·Granted Jan 18, 1983·27 cites·3 claims
- 3073US7989081B2Resin composite copper foil, printed wiring board, and production processes thereofMITSUBISHI GAS CHEMICAL CO·Filed 2007·Granted Aug 2, 2011·5 cites·11 claims
- 3173US4554346APreparation of curable resin from cyanate ester compoundMITSUBISHI GAS CHEMICAL CO·Filed 1984·Granted Nov 19, 1985·24 cites·7 claims
- 3271US5186880AProcess for producing cyanate ester resin cure productMITSUBISHI GAS CHEMICAL CO·Filed 1990·Granted Feb 16, 1993·19 cites·8 claims
- 3369US8377544B2Glass fabric base material/thermosetting resin copper-clad laminate having a high-elasticityMITSUBISHI GAS CHEMICAL CO·Filed 2010·Granted Feb 19, 2013·1 cites·2 claims
- 3468US4469859ACurable resin composition comprising cyanate ester and cyclopentadieneMITSUBISHI GAS CHEMICAL CO·Filed 1980·Granted Sep 4, 1984·19 cites·8 claims
- 3566US7140103B2Process for the production of high-density printed wiring boardMITSUBISHI GAS CHEMICAL CO·Filed 2002·Granted Nov 28, 2006·13 cites·8 claims
- 3666US4785034APolyolefin resin compositionMITSUBISHI GAS CHEMICAL CO·Filed 1987·Granted Nov 15, 1988·18 cites·11 claims
- 3765US6750422B2Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making holeMITSUBISHI GAS CHEMICAL CO·Filed 2001·Granted Jun 15, 2004·8 cites·6 claims
- 3865US3987230ALaminates and process for production thereofMITSUBISHI GAS CHEMICAL CO·Filed 1975·Granted Oct 19, 1976·21 cites·18 claims
- 3963US4585855AProcess for producing curable resin composition from cyanate ester and maleimide/diamine reaction productMITSUBISHI GAS CHEMICAL CO·Filed 1985·Granted Apr 29, 1986·14 cites·11 claims
- 4061US4645805AAdhesive composition and adhesive film or sheet on which the composition is coatedMITSUBISHI GAS CHEMICAL CO·Filed 1985·Granted Feb 24, 1987·20 cites·7 claims
- 4158US4429112AProcess of delaying cure of curable resin composition containing cyanate ester compound with benzene sulfonic acid compoundMITSUBISHI GAS CHEMICAL CO·Filed 1982·Granted Jan 31, 1984·15 cites·7 claims
- 4250US4820855AProcess for producing polyfunctional cyanate ester polymerMITSUBISHI GAS CHEMICAL CO·Filed 1987·Granted Apr 11, 1989·7 cites·4 claims
- 4349US4717609AAdhesive composition and adhesive film or sheet on which the composition is coatedMITSUBISHI GAS CHEMICAL CO·Filed 1986·Granted Jan 5, 1988·13 cites·7 claims
- 4448US2006089070A1Glass fabric base material/thermosetting resin copper-clad laminate having a high-elasticityGAKU MORIO·Filed 2005·Application pending·0 cites
- 4545US5160787AElectrical laminate having ability to absorb ultraviolet raysMITSUBISHI GAS CHEMICAL CO·Filed 1991·Granted Nov 3, 1992·16 cites·6 claims
- 4645US5076864AProcess for producing multilayer printed wiring boardMITSUBISHI GAS CHEMICAL CO·Filed 1989·Granted Dec 31, 1991·12 cites·6 claims
- 4744US2004182819A1Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making holeFiled 2004·Application pending·0 cites
- 4840US2004171189A1Semiconductor plastic package and process for the production thereofFiled 2004·Application pending·0 cites
- 4937US2004091688A1Heat-resistant film base-material-inserted B-staged resin composition sheet excellent in adhesion to resin, multilayer board using the sheet and manufacturing process of the multilayer boardFiled 2003·Application pending·0 cites
- 5036US6229096B1Nonwoven reinforcement for printed wiring base board and process for producing the sameMITSUBISHI GAS CHEMICAL CO·Filed 1998·Granted May 8, 2001·7 cites·9 claims
Showing the top 50 of 51 patent records by PatentIndex Score.
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