Inventor · disambiguated record
Yun Hwi Park
Also filed as: PARK YUN HWI
11 granted patents·15 pending applications·71 citations·filing 1998–2024
88Inventor score
Top patents by PatentIndex Score
26 records- 0182US7692490B2Power amplifying device having linearizerSAMSUNG ELECTRO MECH·Filed 2008·Granted Apr 6, 2010·12 cites·6 claims
- 0280US7872869B2Electronic chip moduleSAMSUNG ELECTRO MECH·Filed 2009·Granted Jan 18, 2011·9 cites·11 claims
- 0379US8043896B2Semiconductor chip, method of manufacturing the semiconductor chip and semiconductor chip package including an inclined via holeSAMSUNG ELECTRO MECH·Filed 2009·Granted Oct 25, 2011·7 cites·1 claims
- 0474US7745911B2Semiconductor chip packageSAMSUNG ELECTRO MECH·Filed 2008·Granted Jun 29, 2010·5 cites·9 claims
- 0571US6160469ALarge value buried inductors in low temperature co-fired ceramic circuit boardsSARNOFF CORP·Filed 1998·Granted Dec 12, 2000·22 cites·12 claims
- 0658US7649431B2Band pass filterSAMSUNG ELECTRO MECH·Filed 2007·Granted Jan 19, 2010·2 cites·7 claims
- 0757US2025098036A1Method for manufacturing electrostatic chuckBOBOO HI TECH CO LTD·Filed 2024·Application pending·0 cites
- 0850US9681551B2Low temperature co-fired ceramic substrate with embeded capacitorsSAMSUNG ELECTRO MECH·Filed 2014·Granted Jun 13, 2017·0 cites·12 claims
- 0948US8053682B2Multilayer ceramic substrateSAMSUNG ELECTRO MECH·Filed 2009·Granted Nov 8, 2011·0 cites·4 claims
- 1048US2007267725A1Semiconductor chip, method of manufacturing the semiconductor chip and semiconductor chip packageSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 1148US2010053908A1Electric device moduleSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1246US9101064B2Thin film electrode ceramic substrate and method for manufacturing the sameYOO WON HEE·Filed 2012·Granted Aug 4, 2015·0 cites·6 claims
- 1346US6191934B1High dielectric constant embedded capacitorsSARNOFF CORP & CO LTD·Filed 1998·Granted Feb 20, 2001·14 cites·19 claims
- 1446US2010102430A1Semiconductor multi-chip packageSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1546US2007176302A1Low temperature co-fired ceramic module and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 1645US2013032384A1Thin film electrode ceramic substrate and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 1744US2010171200A1Semiconductor chip packageSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 1843US2011063066A1Space transformer for probe card and method of repairing space transformerSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1941US8637143B2LTCC composition, LTCC substrate comprising the same and method of manufacturing the sameCHO BEOM JOON·Filed 2011·Granted Jan 28, 2014·0 cites·6 claims
- 2041US2007139129A1RF balanced matching deviceSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 2141US2012037610A1Ceramic firing furnaceYOO WON HEE·Filed 2011·Application pending·0 cites
- 2239US2009184779A1Wireless communication moduleSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 2338US2013017504A1FurnaceSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 2438US2015028912A1Board for probe card, method of manufacturing the same, and probe cardSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2537US2012048602A1Method of manufacturing ceramic substrate for probe card and ceramic substrate for probe cardLEE TAEK JUNG·Filed 2011·Application pending·0 cites
- 2630US2012007781A1Antenna moduleKIM JOO YONG·Filed 2011·Application pending·0 cites
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