Inventor · disambiguated record
John Liebeskind
Also filed as: LIEBESKIND JOHN · LIEBESKIND JOHN G · LIEBESKIND JOHN GARY
19 granted patents·8 pending applications·249 citations·filing 1996–2019
95Inventor score
Files withHEWLETT PACKARD DEVELOPMENT CO16HEWLETT PACKARD CO2FAASE KENNETH1LIEBESKIND JOHN1MCKINNELL JAMES C1
Top patents by PatentIndex Score
27 records- 0190US6878638B2Multi-level integrated circuit for wide-gap substrate bondingHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Apr 12, 2005·52 cites·16 claims
- 0289US6534850B2Electronic device sealed under vacuum containing a getter and method of operationHEWLETT PACKARD CO·Filed 2001·Granted Mar 18, 2003·44 cites·35 claims
- 0387US11668528B2Transmitting and detecting light with optical fiber during sinteringHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Jun 6, 2023·2 cites·14 claims
- 0483US7045958B2Vacuum device having a getterHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted May 16, 2006·17 cites·40 claims
- 0577US6686642B2Multi-level integrated circuit for wide-gap substrate bondingHEWLETT PACKARD DEVELOPMENT CO·Filed 2001·Granted Feb 3, 2004·22 cites·17 claims
- 0674US6988924B2Method of making a getter structureHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Jan 24, 2006·9 cites·38 claims
- 0772US7042075B2Electronic device sealed under vacuum containing a getter and method of operationHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted May 9, 2006·14 cites·18 claims
- 0866US7332411B2Systems and methods for wafer bonding by localized induction heatingHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Feb 19, 2008·13 cites·17 claims
- 0966US7205675B2Micro-fabricated device with thermoelectric device and method of makingHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Apr 17, 2007·11 cites·29 claims
- 1066US5855835AMethod and apparatus for laser ablating a nozzle memberHEWLETT PACKARD CO·Filed 1996·Granted Jan 5, 1999·28 cites·14 claims
- 1165US6969667B2Electrical device and method of makingHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Nov 29, 2005·16 cites·40 claims
- 1264US7608998B2Vacuum device having non-evaporable getter component with increased exposed surface areaHEWLETT PACKARD DEVELOPMENT CO·Filed 2006·Granted Oct 27, 2009·1 cites·27 claims
- 1362US8678571B2Fluid ejection cartridgeWAGNER WILLIAM R·Filed 2008·Granted Mar 25, 2014·3 cites·10 claims
- 1460US11865618B2Tracer gas endpoint-monitored sinter systemsHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Jan 9, 2024·0 cites·15 claims
- 1560US11806788B2Sintering furnaceHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Nov 7, 2023·0 cites·14 claims
- 1655US7508132B2Device having a getter structure and a photomaskHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Mar 24, 2009·6 cites·56 claims
- 1755US7294914B2Interconnect structureHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Nov 13, 2007·5 cites·31 claims
- 1852US6756244B2Interconnect structureHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Jun 29, 2004·4 cites·22 claims
- 1949US2007152352A1Micro-fabricated device with thermoelectric device and method of makingMCKINNELL JAMES C·Filed 2007·Application pending·0 cites
- 2048US2006183299A1Electronic device sealed under vacuum containing a getter and method of operationLIEBESKIND JOHN·Filed 2006·Application pending·0 cites
- 2147US7129503B2Determining emitter beam size for data storage mediumHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Oct 31, 2006·2 cites·31 claims
- 2246US2006087232A1Method of making a getter structureRAMAMOORTHI SRIRAM·Filed 2005·Application pending·0 cites
- 2343US2006033676A1Display deviceFAASE KENNETH·Filed 2004·Application pending·0 cites
- 2440US2004147056A1Micro-fabricated device and method of makingFiled 2003·Application pending·0 cites
- 2538US2005085053A1Method of activating a getter structureFiled 2003·Application pending·0 cites
- 2636US2003141802A1Electronic device having a getter used as a circuit elementFiled 2002·Application pending·0 cites
- 2733US2002186017A1Micro high-vacuum pressure sensorFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →