Inventor · disambiguated record
Herman F. Van Dyk Soerewyn
Also filed as: VAN DYK SOEREWYN HERMAN · VAN DYK SOEREWYN HERMAN F
6 granted patents·125 citations·filing 1981–1989
85Inventor score
Top patents by PatentIndex Score
6 records- 0171US5078082AMethod and apparatus for applying bonding material to a populated mounting surfaceSMT EAST CORP·Filed 1989·Granted Jan 7, 1992·34 cites·17 claims
- 0268US4626478AElectronic circuit device components having integral spacers providing uniform thickness bonding filmUNITRODE CORP·Filed 1984·Granted Dec 2, 1986·30 cites·11 claims
- 0358US4538168AHigh power semiconductor packageUNITRODE CORP·Filed 1984·Granted Aug 27, 1985·22 cites·13 claims
- 0458US4514587AHigh power semiconductor packageUNITRODE CORP·Filed 1981·Granted Apr 30, 1985·22 cites·14 claims
- 0543US4443655AExtruded semiconductor package and fabrication methodUNITRODE CORP·Filed 1981·Granted Apr 17, 1984·8 cites·15 claims
- 0638US4536825ALeadframe having severable fingers for aligning one or more electronic circuit device componentsUNITRODE CORP·Filed 1984·Granted Aug 20, 1985·9 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →