Inventor · disambiguated record
Wedanni Linsangan Micla
Also filed as: MICLA WEDANNI LINSANGAN
5 granted patents·18 citations·filing 2015–2021
74Inventor score
Files withUTAC HEADQUARTERS PTE LTD5
Top patents by PatentIndex Score
5 records- 0190US9978658B2Semiconductor packages and methods of packaging semiconductor devicesUTAC HEADQUARTERS PTE LTD·Filed 2016·Granted May 22, 2018·8 cites·18 claims
- 0285US9508623B2Semiconductor packages and methods of packaging semiconductor devicesUTAC HEADQUARTERS PTE LTD·Filed 2015·Granted Nov 29, 2016·5 cites·31 claims
- 0383US11177301B2Reliable semiconductor packagesUTAC HEADQUARTERS PTE LTD·Filed 2019·Granted Nov 16, 2021·5 cites·20 claims
- 0455US10354934B2Semiconductor packages and methods of packaging semiconductor devicesUTAC HEADQUARTERS PTE LTD·Filed 2018·Granted Jul 16, 2019·0 cites·11 claims
- 0549US12021096B2Reliable semiconductor packagesUTAC HEADQUARTERS PTE LTD·Filed 2021·Granted Jun 25, 2024·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →