Inventor · disambiguated record
Yuichi Kawato
Also filed as: KAWATO YUICHI
3 granted patents·5 pending applications·6 citations·filing 2012–2014
58Inventor score
Top patents by PatentIndex Score
8 records- 0167US9120944B2Copper particulate dispersion, conductive film forming method and circuit boardKAWATO YUICHI·Filed 2012·Granted Sep 1, 2015·4 cites·3 claims
- 0262US9905339B2Conductive film forming method and sintering promoterISHIHARA CHEMICAL CO LTD·Filed 2013·Granted Feb 27, 2018·1 cites·5 claims
- 0352US9615455B2Copper particulate dispersion, conductive film forming method and circuit boardKAWATO YUICHI·Filed 2012·Granted Apr 4, 2017·1 cites·8 claims
- 0446US2015030784A1Conductive film forming method and sintering promoterISHIHARA CHEMICAL CO LTD·Filed 2013·Application pending·0 cites
- 0544US2016029483A1Copper particulate dispersion, conductive film forming method, and circuit boardISHIHARA CHEMICAL CO LTD·Filed 2014·Application pending·0 cites
- 0644US2016007455A1Copper particulate dispersion, conductive film forming method, and circuit boardISHIHARA CHEMICAL CO LTD·Filed 2014·Application pending·0 cites
- 0743US2015021071A1Circuit board, conductive film forming method and adhesiveness improverISHIHARA CHEMICAL CO LTD·Filed 2013·Application pending·0 cites
- 0840US2014216799A1Conductive film forming method, copper particulate dispersion and circuit boardKAWATO YUICHI·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →