Inventor · disambiguated record
Dae-Young Choi
Also filed as: CHOI DAE · CHOI DAE-YOUNG
29 granted patents·16 pending applications·147 citations·filing 2010–2024
96Inventor score
Files withLG INNOTEK CO LTD11HYUNDAI MOTOR CO LTD8SAMSUNG ELECTRONICS CO LTD6SKAICHIPS CO LTD5KIM TAE HUN3
Top patents by PatentIndex Score
45 records- 0197US8293580B2Method of forming package-on-package and device related theretoKIM TAE-HUN·Filed 2011·Granted Oct 23, 2012·63 cites·12 claims
- 0291US12232273B2Printed circuit board and method of fabricating the sameLG INNOTEK CO LTD·Filed 2023·Granted Feb 18, 2025·0 cites·20 claims
- 0390US11723153B2Printed circuit board and method of fabricating the sameLG INNOTEK CO LTD·Filed 2022·Granted Aug 8, 2023·1 cites·20 claims
- 0487US8531034B2Semiconductor package and package on package having the sameBYUN HAK-KYOON·Filed 2011·Granted Sep 10, 2013·9 cites·20 claims
- 0586US8653640B2Semiconductor package apparatusKIM TAE-HUN·Filed 2012·Granted Feb 18, 2014·11 cites·20 claims
- 0684US8759959B2Stacked semiconductor packagesYIM CHOONG-BIN·Filed 2011·Granted Jun 24, 2014·7 cites·10 claims
- 0784US8525341B2Printed circuit board having different sub-core layers and semicondutor package comprising the sameKIM HYUN-KI·Filed 2011·Granted Sep 3, 2013·7 cites·19 claims
- 0882US9343535B2Semiconductor packages having a guide wall and related systems and methodsLEE JUNG-DO·Filed 2013·Granted May 17, 2016·8 cites·15 claims
- 0982US8338941B2Semiconductor packages and methods of fabricating the sameLEE JINHO·Filed 2010·Granted Dec 25, 2012·9 cites·20 claims
- 1081US8759967B2Semiconductor package and package on package having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jun 24, 2014·4 cites·14 claims
- 1180US9255551B2Diesel-gasoline dual fuel powered engine with fouling free clean EGR systemHYUNDAI MOTOR CO LTD·Filed 2012·Granted Feb 9, 2016·6 cites·4 claims
- 1279US9121336B2Diesel engine pistonLEE MYUNGJUN·Filed 2011·Granted Sep 1, 2015·10 cites·9 claims
- 1376US9190401B2Stacked semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Nov 17, 2015·3 cites·19 claims
- 1475US11297720B2Printed circuit board and method of fabricating the sameLG INNOTEK CO LTD·Filed 2021·Granted Apr 5, 2022·0 cites·19 claims
- 1574US9686860B2Printed circuit board and method of fabricating the sameLG INNOTEK CO LTD·Filed 2015·Granted Jun 20, 2017·1 cites·16 claims
- 1674US2025085674A1Scalable analog pim module, method of controlling analog pim, signal processing circuit, and sensor deviceSKAICHIPS CO LTD·Filed 2024·Application pending·0 cites
- 1773US11019731B2Printed circuit board and method of fabricating the sameLG INNOTEK CO LTD·Filed 2020·Granted May 25, 2021·0 cites·20 claims
- 1873US9111926B2Semiconductor package and package on package having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Aug 18, 2015·2 cites·12 claims
- 1972US8970025B2Stacked packages having through hole viasSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Mar 3, 2015·2 cites·9 claims
- 2071US8754515B2Stacked packages having through hole viasKIM TAE-HUN·Filed 2012·Granted Jun 17, 2014·2 cites·13 claims
- 2170US10798827B2Printed circuit board and method of fabricating the sameLG INNOTEK CO LTD·Filed 2019·Granted Oct 6, 2020·0 cites·20 claims
- 2267US11889634B2Printed circuit board and method of manufacturing the sameLG INNOTEK CO LTD·Filed 2020·Granted Jan 30, 2024·0 cites·19 claims
- 2366US12174595B2Scalable analog PIM module, method of controlling analog PIM, signal processing circuit, and sensor deviceSKAICHIPS CO LTD·Filed 2022·Granted Dec 24, 2024·0 cites·19 claims
- 2466US8977474B2Diesel-gasoline dual fuel powered combustion engine system provided with spark-assisted fouling free EGR systemHYUNDAI MOTOR CO LTD·Filed 2012·Granted Mar 10, 2015·2 cites·2 claims
- 2564US10531569B2Printed circuit board and method of fabricating the sameLG INNOTEK CO LTD·Filed 2018·Granted Jan 7, 2020·0 cites·18 claims
- 2663US9913383B2Printed circuit board and method of fabricating the sameLG INNOTEK CO LTD·Filed 2017·Granted Mar 6, 2018·0 cites·20 claims
- 2760US2025078585A1Method of diagnosing vehicle considering weight of sensing element for motor in vehicle and system using the sameSKAICHIPS CO LTD·Filed 2024·Application pending·0 cites
- 2859US2024175299A1Door opening and closing apparatus for prevention of door opening during collisionHYUNDAI MOTOR CO LTD·Filed 2023·Application pending·0 cites
- 2956US9820378B2Printed circuit board and method of manufacturing the sameLG INNOTEK CO LTD·Filed 2016·Granted Nov 14, 2017·0 cites·15 claims
- 3055US2024001939A1Method for monitoring failure of motor in a car based on scaling algorithm and system using the sameSKAICHIPS CO LTD·Filed 2023·Application pending·0 cites
- 3153US10912202B2Method of manufacturing printed circuit boardLG INNOTEK CO LTD·Filed 2017·Granted Feb 2, 2021·0 cites·18 claims
- 3253US2023368591A1Method for monitoring failure of motor in a car based on clustering algorithm and system using the sameSKAICHIPS CO LTD·Filed 2023·Application pending·0 cites
- 3341US8952513B2Stack type semiconductor package and method of fabricating the sameYIM CHOONG-BIN·Filed 2011·Granted Feb 10, 2015·0 cites·20 claims
- 3441US2014061890A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 3540US9175612B2Method and apparatus for controlling combustion of engine having mixed combustion modeHYUNDAI MOTOR CO LTD·Filed 2014·Granted Nov 3, 2015·0 cites·24 claims
- 3640US2013152899A1Dual fuel combustion system based on diesel compression ignition triggered ignition controlHYUNDAI MOTOR CO LTD·Filed 2012·Application pending·0 cites
- 3739US2013241044A1Semiconductor package having protective layer and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2012·Application pending·0 cites
- 3838US2013087123A1Diesel-gasoline hybrid engineKI MINYOUNG·Filed 2011·Application pending·0 cites
- 3938US2015114355A1Method and apparatus for controlling combustion of engine having mixed combustion modeHYUNDAI MOTOR CO LTD·Filed 2014·Application pending·0 cites
- 4038US2012193783A1Package on packageHONG JI-SUN·Filed 2011·Application pending·0 cites
- 4137US2011291294A1Multi-Chip PackageKIM SANG-UK·Filed 2011·Application pending·0 cites
- 4236US2013158837A1Variable-ignition diesel-gasoline dual fuel powered combustion engine, system, and method for controlling of the sameHYUNDAI MOTOR CO LTD·Filed 2012·Application pending·0 cites
- 4336US2013152898A1Variable ignition type diesel-gasoline dual fuel powered combustion engine, system, and methodHYUNDAI MOTOR CO LTD·Filed 2012·Application pending·0 cites
- 4436US2011109000A1Semiconductor package and method of forming the sameKIM SANG-UK·Filed 2010·Application pending·0 cites
- 4536US2013112780A1Multi-sac injectorJUNG HYUNSUNG·Filed 2012·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Dae-Young Choi files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →