Inventor · disambiguated record
Li-Hsin Tseng
Also filed as: TSENG LI HSIN
8 granted patents·5 pending applications·114 citations·filing 2001–2011
86Inventor score
Files withTAIWAN SEMICONDUCTOR MFG7LAM TAI-SENG2VISERA TECHNOLOGIES CO LTD2HUANG HON-LIN1TSAI MON-CHIN1
Top patents by PatentIndex Score
13 records- 0180US7122458B2Method for fabricating pad redistribution layerTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Oct 17, 2006·35 cites·17 claims
- 0275US6486054B1Method to achieve robust solder bump heightTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Nov 26, 2002·25 cites·26 claims
- 0372US6696356B2Method of making a bump on a substrate without ribbon residueTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Feb 24, 2004·23 cites·30 claims
- 0465US7964936B2Electronic device package with electromagnetic compatibility (EMC) coating thereonVISERA TECHNOLOGIES CO LTD·Filed 2008·Granted Jun 21, 2011·3 cites·26 claims
- 0563US7187078B2Bump structureTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Mar 6, 2007·13 cites·21 claims
- 0661US8355628B2Compact camera moduleVISERA TECHNOLOGIES CO LTD·Filed 2009·Granted Jan 15, 2013·1 cites·6 claims
- 0761US7459386B2Method for forming solder bumps of increased heightTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Dec 2, 2008·14 cites·11 claims
- 0842US2008303154A1Through-silicon via interconnection formed with a cap layerHUANG HON-LIN·Filed 2007·Application pending·0 cites
- 0939US2008251916A1UBM structure for strengthening solder bumpsTAIWAN SEMICONDUCTOR MFG·Filed 2007·Application pending·0 cites
- 1037US2012252526A1Handset unit and telephone deviceLAM TAI-SENG·Filed 2011·Application pending·0 cites
- 1137US2012243677A1Handset unit and telephone deviceLAM TAI-SENG·Filed 2011·Application pending·0 cites
- 1234US2006087039A1Ubm structure for improving reliability and performanceTAIWAN SEMICONDUCTOR MFG·Filed 2004·Application pending·0 cites
- 1332US8669658B2Crosstalk-free WLCSP structure for high frequency applicationTSAI MON-CHIN·Filed 2007·Granted Mar 11, 2014·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →