Inventor · disambiguated record
Thomas H. Dozier, Ii
Also filed as: DOZIER II THOMAS H · DOZIER THOMAS H · DOZIER THOMAS H II · DOZIER THOMAS HUDSON
21 granted patents·5 pending applications·3,131 citations·filing 1994–2014
98Inventor score
Top patents by PatentIndex Score
26 records- 0199US6913468B2Methods of removably mounting electronic components to a circuit board, and sockets formed by the methodsFORMFACTOR INC·Filed 2003·Granted Jul 5, 2005·154 cites·26 claims
- 0299US6741085B1Contact carriers (tiles) for populating larger substrates with spring contactsFORMFACTOR INC·Filed 1997·Granted May 25, 2004·175 cites·19 claims
- 0399US5806181AContact carriers (tiles) for populating larger substrates with spring contactsFORMFACTOR INC·Filed 1997·Granted Sep 15, 1998·452 cites·21 claims
- 0499US5772451ASockets for electronic components and methods of connecting to electronic componentsFORMFACTOR INC·Filed 1995·Granted Jun 30, 1998·648 cites·92 claims
- 0598US6836962B2Method and apparatus for shaping spring elementsFORMFACTOR INC·Filed 2000·Granted Jan 4, 2005·148 cites·5 claims
- 0698US6701612B2Method and apparatus for shaping spring elementsFORMFACTOR INC·Filed 2000·Granted Mar 9, 2004·135 cites·38 claims
- 0798US6669489B1Interposer, socket and assembly for socketing an electronic component and method of making and using sameFORMFACTOR INC·Filed 1998·Granted Dec 30, 2003·166 cites·21 claims
- 0898US6534856B1Sockets for “springed” semiconductor devicesFORMFACTOR INC·Filed 2001·Granted Mar 18, 2003·138 cites·29 claims
- 0997US6232149B1Sockets for “springed” semiconductor devicesFORMFACTOR INC·Filed 2000·Granted May 15, 2001·98 cites·2 claims
- 1097US6033935ASockets for "springed" semiconductor devicesFORMFACTOR INC·Filed 1998·Granted Mar 7, 2000·174 cites·3 claims
- 1195US7347702B2Contact carriers (tiles) for populating larger substrates with spring contactsFORMFACTOR INC·Filed 2006·Granted Mar 25, 2008·25 cites·18 claims
- 1295US6442831B1Method for shaping spring elementsFORMFACTOR INC·Filed 1997·Granted Sep 3, 2002·92 cites·13 claims
- 1395US5820014ASolder preformsFORMFACTOR INC·Filed 1996·Granted Oct 13, 1998·196 cites·16 claims
- 1495US5473510ALand grid array package/circuit board assemblies and methods for constructing the sameCONVEX COMPUTER CORP·Filed 1994·Granted Dec 5, 1995·214 cites·15 claims
- 1594US7140883B2Contact carriers (tiles) for populating larger substrates with spring contactsFORMFACTOR INC·Filed 2003·Granted Nov 28, 2006·44 cites·22 claims
- 1694US6642625B2Sockets for “springed” semiconductor devicesFORMFACTOR INC·Filed 2002·Granted Nov 4, 2003·70 cites·11 claims
- 1793US7733106B2Apparatus and method of testing singulated diesFORMFACTOR INC·Filed 2006·Granted Jun 8, 2010·19 cites·30 claims
- 1892US7714598B2Contact carriers (tiles) for populating larger substrates with spring contactsFORMFACTOR INC·Filed 2008·Granted May 11, 2010·17 cites·4 claims
- 1991US6150186AMethod of making a product with improved material properties by moderate heat-treatment of a metal incorporating a dilute additiveFORMFACTOR INC·Filed 1998·Granted Nov 21, 2000·147 cites·2 claims
- 2077US7059047B2Sockets for “springed” semiconductor devicesFORMFACTOR INC·Filed 2003·Granted Jun 13, 2006·15 cites·38 claims
- 2173US8513969B2Apparatus and method of testing singulated diesDOZIER II THOMAS H·Filed 2010·Granted Aug 20, 2013·4 cites·19 claims
- 2263US2014356824A1System and method for treatment of stimuli induced psychological disordersDOZIER THOMAS HUDSON·Filed 2014·Application pending·0 cites
- 2351US2006223345A1Sockets for "springed" semiconductor devicesFORMFACTOR INC·Filed 2006·Application pending·0 cites
- 2446US2008116927A1Contact tip structure for microelectronic interconnection elements and methods of making sameFORMFACTOR INC·Filed 2008·Application pending·0 cites
- 2538US2003199179A1Contact tip structure for microelectronic interconnection elements and method of making sameFORMFACTOR INC·Filed 2001·Application pending·0 cites
- 2635US2001009724A1Method of making a product with improved material properties by moderate heat treatment of a metal incorporating a dilute additiveFiled 2001·Application pending·0 cites
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