Inventor · disambiguated record
Keisuke Tokubuchi
Also filed as: TOKUBUCHI KEISUKE
10 granted patents·1 pending application·634 citations·filing 1998–2024
91Inventor score
Top patents by PatentIndex Score
11 records- 0194US6294439B1Method of dividing a wafer and method of manufacturing a semiconductor deviceTOSHIBA KK·Filed 2000·Granted Sep 25, 2001·139 cites·26 claims
- 0294US5888883AMethod of dividing a wafer and method of manufacturing a semiconductor deviceTOSHIBA KK·Filed 1998·Granted Mar 30, 1999·221 cites·8 claims
- 0390US6337258B1Method of dividing a waferTOSHIBA KK·Filed 2000·Granted Jan 8, 2002·59 cites·16 claims
- 0485US6352073B1Semiconductor manufacturing equipmentTOSHIBA KK·Filed 1999·Granted Mar 5, 2002·68 cites·13 claims
- 0583US11551973B2Semiconductor device manufacturing method and semiconductor deviceKIOXIA CORP·Filed 2021·Granted Jan 10, 2023·1 cites·20 claims
- 0683US6238515B1Wafer transfer apparatusLINTEC CORP·Filed 1999·Granted May 29, 2001·68 cites·10 claims
- 0783US6184109B1Method of dividing a wafer and method of manufacturing a semiconductor deviceTOSHIBA KK·Filed 1999·Granted Feb 6, 2001·76 cites·30 claims
- 0868US10950468B2Semiconductor manufacturing apparatusTOSHIBA MEMORY CORP·Filed 2018·Granted Mar 16, 2021·1 cites·11 claims
- 0961US2024429118A1Semiconductor device and method of manufacturing semiconductor deviceKIOXIA CORP·Filed 2024·Application pending·0 cites
- 1047US11309219B2Method for manufacturing semiconductor deviceKIOXIA CORP·Filed 2020·Granted Apr 19, 2022·0 cites·19 claims
- 1147US6739326B2Semiconductor manufacturing equipmentTOSHIBA KK·Filed 2001·Granted May 25, 2004·1 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →