Inventor · disambiguated record
Yasuto Ishida
Also filed as: ISHIDA YASUTO
17 granted patents·7 pending applications·38 citations·filing 1974–2025
89Inventor score
Top patents by PatentIndex Score
24 records- 0194US10876073B2Composition for surface treatment, and method for surface treatment using the sameFUJIMI INC·Filed 2017·Granted Dec 29, 2020·13 cites·13 claims
- 0288US9486892B2Polishing compositionFUJIMI INC·Filed 2013·Granted Nov 8, 2016·13 cites·5 claims
- 0378US10876082B2Surface treatment composition, method for producing surface treatment composition, surface treatment method, and method for producing semiconductor substrateFUJIMI INC·Filed 2018·Granted Dec 29, 2020·2 cites·14 claims
- 0473US12249513B2Surface treatment method, method for producing semiconductor substrate including the surface treatment method, composition for surface treatment, and system for producing semiconductor substrate including the composition for surface treatmentFUJIMI INC·Filed 2022·Granted Mar 11, 2025·0 cites·8 claims
- 0571US10781410B2Composition for surface treatment and method for surface treatment using the sameFUJIMI INC·Filed 2018·Granted Sep 22, 2020·1 cites·10 claims
- 0669US10916435B2Surface treatment composition, method of producing surface treatment composition, method of treating surface, and method of producing semiconductor substrateFUJIMI INC·Filed 2017·Granted Feb 9, 2021·1 cites·20 claims
- 0767US2023027432A1Surface treatment composition, method for producing surface treatment composition, surface treatment method, and method for producing semiconductor substrateFUJIMI INC·Filed 2022·Application pending·0 cites
- 0867US2025183044A1Surface treatment method, method for producing semiconductor substrate including the surface treatment method, composition for surface treatment, and system for producing semiconductor substrate including the composition for surface treatmentFUJIMI INC·Filed 2025·Application pending·0 cites
- 0966US11466234B2Surface treatment composition, method for producing surface treatment composition, surface treatment method, and method for producing semiconductor substrateFUJIMI INC·Filed 2020·Granted Oct 11, 2022·0 cites·16 claims
- 1063US4014941AMethod of producing α,β-unsaturated etherKYOWA YUKA KK·Filed 1974·Granted Mar 29, 1977·7 cites·13 claims
- 1162US12312499B2Surface treatment method, method for producing semiconductor substrate including the surface treatment method, composition for surface treatment, and system for producing semiconductor substrate including the composition for surface treatmentFUJIMI INC·Filed 2022·Granted May 27, 2025·0 cites·13 claims
- 1255US11692137B2Intermediate raw material, and polishing composition and composition for surface treatment using the sameFUJIMI INC·Filed 2021·Granted Jul 4, 2023·0 cites·6 claims
- 1353US8703007B2Polishing composition and polishing method using the sameAKATSUKA TOMOHIKO·Filed 2011·Granted Apr 22, 2014·1 cites·16 claims
- 1452US2022325140A1Composition for surface treatment, surface treatment method, and method for producing semiconductor substrateFUJIMI INC·Filed 2022·Application pending·0 cites
- 1551US11702570B2Polishing compositionFUJIMI INC·Filed 2020·Granted Jul 18, 2023·0 cites·23 claims
- 1649US10954479B2Composition for surface treatment and surface treatment method using the sameFUJIMI INC·Filed 2017·Granted Mar 23, 2021·0 cites·11 claims
- 1746US11162057B2Composition for surface treatment, method for producing composition for surface treatment, surface treatment method, and method for producing semiconductor substrateFUJIMI INC·Filed 2018·Granted Nov 2, 2021·0 cites·12 claims
- 1846US10093834B2Polishing composition and polishing methodFUJIMI INC·Filed 2015·Granted Oct 9, 2018·0 cites·17 claims
- 1944US11203731B2Composition for surface treatment and method of producing the same, surface treatment method, and method of producing semiconductor substrateFUJIMI INC·Filed 2018·Granted Dec 21, 2021·0 cites·16 claims
- 2042US11028340B2Composition for surface treatment, method for producing the same, surface treatment method using composition for surface treatment, and method for producing semiconductor substrateFUJIMI INC·Filed 2018·Granted Jun 8, 2021·0 cites·21 claims
- 2141US2020095467A1Intermediate raw material, and polishing composition and composition for surface treatment using the sameFUJIMI INC·Filed 2019·Application pending·0 cites
- 2239US2020017719A1Composition for surface treatment, method for producing the same, surface treatment method using composition for surface treatment, and method for producing semiconductor substrateFUJIMI INC·Filed 2018·Application pending·0 cites
- 2338US2021005462A1Surface treatment composition, method for producing surface treatment composition, surface treatment method, and method for producing semiconductor substrateFUJIMI INC·Filed 2019·Application pending·0 cites
- 2436US2020299543A1Polishing compositionFUJIMI INC·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →