Inventor · disambiguated record
Tomoki Yoshino
Also filed as: YOSHINO TOMOKI
4 granted patents·1 pending application·4 citations·filing 2016–2024
58Inventor score
Files withDISCO CORP5
Top patents by PatentIndex Score
5 records- 0190US10081076B2Wafer producing methodDISCO CORP·Filed 2016·Granted Sep 25, 2018·4 cites·3 claims
- 0259US2025079331A1Method of manufacturing waferDISCO CORP·Filed 2024·Application pending·0 cites
- 0345US10610974B2Laser processing apparatus and laser processing methodDISCO CORP·Filed 2018·Granted Apr 7, 2020·0 cites·7 claims
- 0436US10096517B2Wafer processing methodDISCO CORP·Filed 2017·Granted Oct 9, 2018·0 cites·6 claims
- 0531US9997392B2Wafer processing methodDISCO CORP·Filed 2017·Granted Jun 12, 2018·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →