Inventor · disambiguated record
Eun-Seok Song
Also filed as: SONG EUN-SEOK
26 granted patents·2 pending applications·220 citations·filing 2002–2019
95Inventor score
Files withSAMSUNG ELECTRONICS CO LTD18SONG EUN-SEOK6HEALTECH MED INC1LG DISPLAY CO LTD1PARK JIN BAE1
Top patents by PatentIndex Score
28 records- 0194US11244938B2Electronic device packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 8, 2022·15 cites·12 claims
- 0291US7420270B2Tape wiring substrate and chip-on-film package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Sep 2, 2008·20 cites·18 claims
- 0390US7337079B2Time-frequency domain reflectometry apparatus and methodPARK JIN-BAE·Filed 2003·Granted Feb 26, 2008·83 cites·12 claims
- 0489US10475774B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 12, 2019·5 cites·20 claims
- 0588US10424571B2Electronic device packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Sep 24, 2019·6 cites·18 claims
- 0687US7880286B2Tape wiring substrate and chip-on-film package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Feb 1, 2011·12 cites·26 claims
- 0786US7495317B2Semiconductor package with ferrite shielding structureSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Feb 24, 2009·14 cites·17 claims
- 0885US9893020B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Feb 13, 2018·5 cites·10 claims
- 0984US10262967B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Apr 16, 2019·4 cites·14 claims
- 1084US8143713B2Chip-on-board packageSONG EUN-SEOK·Filed 2010·Granted Mar 27, 2012·9 cites·15 claims
- 1183US7489035B2Integrated circuit chip package having a ring-shaped silicon decoupling capacitorSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Feb 10, 2009·12 cites·29 claims
- 1282US8502084B2Semiconductor package including power ball matrix and power ring having improved power integritySONG EUN SEOK·Filed 2010·Granted Aug 6, 2013·7 cites·26 claims
- 1380US7936232B2Substrate for semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted May 3, 2011·5 cites·13 claims
- 1472US8120024B2Semiconductor package having test pads on top and bottom substrate surfaces and method of testing sameSONG EUN-SEOK·Filed 2007·Granted Feb 21, 2012·3 cites·15 claims
- 1566US7705433B2Semiconductor package preventing generation of static electricity thereinSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Apr 27, 2010·3 cites·16 claims
- 1665US8647976B2Semiconductor package having test pads on top and bottom substrate surfaces and method of testing sameSONG EUN-SEOK·Filed 2012·Granted Feb 11, 2014·1 cites·8 claims
- 1765US6720533B2Heater assembly for heating a waferSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Apr 13, 2004·11 cites·12 claims
- 1864US10665575B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 26, 2020·1 cites·20 claims
- 1962US8085545B2Structure for blocking an electromagnetic interference, wafer level package and printed circuit board having the sameSONG EUN-SEOK·Filed 2009·Granted Dec 27, 2011·2 cites·20 claims
- 2062US7508680B2Adjustable-inductance filter, tape distribution substrate comprising the filter, and display panel assembly comprising the tape distribution substrateSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Mar 24, 2009·2 cites·26 claims
- 2154US9746704B2Support structure and liquid crystal display device including the sameLG DISPLAY CO LTD·Filed 2015·Granted Aug 29, 2017·0 cites·16 claims
- 2250US8552521B2Semiconductor package to remove power noise using ground impedanceSONG EUN-SEOK·Filed 2009·Granted Oct 8, 2013·0 cites·21 claims
- 2350US7760044B2Substrate for semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jul 20, 2010·0 cites·19 claims
- 2448US2008099885A1Semiconductor package and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 2543US8084359B2Semiconductor package and methods of manufacturing the sameYOU SE-HO·Filed 2010·Granted Dec 27, 2011·0 cites·13 claims
- 2643US2008099887A1Multi-ground shielding semiconductor package, method of fabricating the package, and method of preventing noise using multi-ground shieldingSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 2739US10864288B2Disinfecting and sterilizing device for medical sensorHEALTECH MED INC·Filed 2017·Granted Dec 15, 2020·0 cites·5 claims
- 2838US10490509B2Substrate having power delivery network for reducing electromagnetic interference and devices including the substrateSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Nov 26, 2019·0 cites·17 claims
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