Inventor · disambiguated record
Leonard H. Radzilowski
Also filed as: RADZILOWSKI LEONARD H · RADZILOWSKI LEONARD HENRY
6 granted patents·10 pending applications·73 citations·filing 2000–2019
78Inventor score
Files withTYCO ELECTRONICS CORP7TE CONNECTIVITY CORP5ELO TOUCHSYSTEMS INC1MALSTROM CHARLES RANDALL1MOSTOLLER MATTHEW E1
Top patents by PatentIndex Score
16 records- 0196US10686282B1Electrical connector for mitigating electrical resonanceTE CONNECTIVITY CORP·Filed 2019·Granted Jun 16, 2020·23 cites·20 claims
- 0284US6469267B1Switch with at least one flexible conductive memberELO TOUCHSYSTEMS INC·Filed 2000·Granted Oct 22, 2002·48 cites·20 claims
- 0363US10276937B2Jet dispensing electrically conductive inksTE CONNECTIVITY CORP·Filed 2017·Granted Apr 30, 2019·1 cites·18 claims
- 0461US9985344B2Electronic article and process of producing an electronic articleTYCO ELECTRONICS CORP·Filed 2014·Granted May 29, 2018·1 cites·15 claims
- 0555US10819008B2Lighting device, streetlighting device, traffic light, and fabrication methodTYCO ELECTRONICS LTD UK·Filed 2019·Granted Oct 27, 2020·0 cites·15 claims
- 0655US2014141548A1Method of manufacturing a metal clad circuit boardTYCO ELECTRONICS CORP·Filed 2013·Application pending·0 cites
- 0749US2013051018A1Metal clad circuit boardMOSTOLLER MATTHEW E·Filed 2011·Application pending·0 cites
- 0849US2016183381A1Electronic Component and Overmolding ProcessTYCO ELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 0942US2018063967A1Interconnections Formed with Conductive Traces Applied onto Substrates Having Low Softening TemperaturesTYCO ELECTRONICS CORP·Filed 2016·Application pending·0 cites
- 1041US2017236610A1Method for Enhancing Adhesion of Silver Nanoparticle Inks Using a Functionalized Alkoxysilane Additive and Primer LayerTYCO ELECTRONICS CORP·Filed 2016·Application pending·0 cites
- 1140US2018301273A1Printed Inductors for Wireless ChargingTE CONNECTIVITY CORP·Filed 2017·Application pending·0 cites
- 1240US2020093002A1Jet Dispensing Electrically Conductive InksTE CONNECTIVITY CORP·Filed 2018·Application pending·0 cites
- 1340US2017233541A1Method of Enhancing Adhesion of Silver Nanoparticle Inks on Plastic Substrates Using a Crosslinked Poly(vinyl butyral) Primer LayerTYCO ELECTRONICS CORP·Filed 2016·Application pending·0 cites
- 1436US9953845B2Methods and systems for forming electronic modulesMALSTROM CHARLES RANDALL·Filed 2011·Granted Apr 24, 2018·0 cites·11 claims
- 1536US2018190896A1Ultrasonic Transmitter and ReceiverTE CONNECTIVITY CORP·Filed 2017·Application pending·0 cites
- 1636US2017238425A1Method of Fabricating Highly Conductive Features with Silver Nanoparticle Ink at Low TemperatureTYCO ELECTRONICS CORP·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →