Inventor · disambiguated record
Burton J. Carpenter
Also filed as: CARPENTER BURTON J · CARPENTER BURTON JESSE · CARPENTER JR BURTON J · CARPENTER JR BURTON JESSE
34 granted patents·12 pending applications·334 citations·filing 1991–2024
96Inventor score
Top patents by PatentIndex Score
46 records- 0197US9012263B1Method for treating a bond pad of a package substrateMATHEW VARUGHESE·Filed 2013·Granted Apr 21, 2015·42 cites·20 claims
- 0296US9437459B2Aluminum clad copper structure of an electronic component package and a method of making an electronic component package with an aluminum clad copper structureCARPENTER BURTON J·Filed 2014·Granted Sep 6, 2016·41 cites·13 claims
- 0393US5374500APositive photoresist composition containing photoacid generator and use thereofIBM·Filed 1993·Granted Dec 20, 1994·80 cites·14 claims
- 0485US12040291B2Radio frequency packages containing multilevel power substrates and associated fabrication methodsNXP USA INC·Filed 2021·Granted Jul 16, 2024·1 cites·20 claims
- 0585US5272042APositive photoresist system for near-UV to visible imagingIBM·Filed 1991·Granted Dec 21, 1993·68 cites·3 claims
- 0681US8674509B2Integrated circuit die assembly with heat spreaderCARPENTER BURTON J·Filed 2012·Granted Mar 18, 2014·6 cites·16 claims
- 0781US7808117B2Integrated circuit having pads and input/output (I/O) cellsFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Oct 5, 2010·12 cites·20 claims
- 0878US11222790B2Tie bar removal for semiconductor device packagingNXP USA INC·Filed 2020·Granted Jan 11, 2022·1 cites·16 claims
- 0978US10325876B2Surface finish for wirebondingMATHEW VARUGHESE·Filed 2014·Granted Jun 18, 2019·4 cites·10 claims
- 1077US10446476B2Packaged integrated circuit having stacked die and method for thereforNXP USA INC·Filed 2018·Granted Oct 15, 2019·3 cites·17 claims
- 1176US8754521B1Semiconductor device assembly having a heat spreaderCARPENTER BURTON J·Filed 2013·Granted Jun 17, 2014·4 cites·17 claims
- 1272US9059144B2Method for forming die assembly with heat spreaderHIGGINS III LEO M·Filed 2012·Granted Jun 16, 2015·3 cites·20 claims
- 1368US11967507B2Tie bar removal for semiconductor device packagingNXP USA INC·Filed 2021·Granted Apr 23, 2024·0 cites·20 claims
- 1468US9111878B2Method for forming a semiconductor device assembly having a heat spreaderHIGGINS III LEO M·Filed 2013·Granted Aug 18, 2015·2 cites·19 claims
- 1568US5990547ASemiconductor device having plated contacts and method thereofMOTOROLA INC·Filed 1998·Granted Nov 23, 1999·38 cites·8 claims
- 1667US8704370B2Semiconductor package structure having an air gap and method for formingUEHLING TRENT S·Filed 2012·Granted Apr 22, 2014·2 cites·20 claims
- 1767US5498765APositive photoresist composition containing photoacid generator and use thereofIBM·Filed 1994·Granted Mar 12, 1996·18 cites·13 claims
- 1862US2024380307A1System comprising a gate driverNXP USA INC·Filed 2024·Application pending·0 cites
- 1959US12347753B2Semiconductor device having galvanic isolation and method thereforNXP USA INC·Filed 2021·Granted Jul 1, 2025·0 cites·20 claims
- 2059US8754518B1Devices and methods for configuring conductive elements for a semiconductor packageCARPENTER BURTON J·Filed 2013·Granted Jun 17, 2014·2 cites·16 claims
- 2157US11462494B2Semiconductor device package having galvanic isolation and method thereforNXP USA INC·Filed 2020·Granted Oct 4, 2022·0 cites·20 claims
- 2254US11502068B2Semiconductor device package having galvanic isolation and method thereforNXP USA INC·Filed 2021·Granted Nov 15, 2022·0 cites·20 claims
- 2352US11164826B2Packaged integrated circuit having stacked die and method for makingNXP USA INC·Filed 2019·Granted Nov 2, 2021·0 cites·14 claims
- 2452US2024332105A1Multidevice package with recessed mounting surfaceNXP USA INC·Filed 2023·Application pending·0 cites
- 2549US9368470B2Coated bonding wire and methods for bonding using sameFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Jun 14, 2016·0 cites·19 claims
- 2649US9324675B2Structures for reducing corrosion in wire bondsCARPENTER BURTON J·Filed 2014·Granted Apr 26, 2016·0 cites·10 claims
- 2746US10734311B2Hybrid lead frame for semiconductor die package with improved creepage distanceNXP USA INC·Filed 2019·Granted Aug 4, 2020·0 cites·20 claims
- 2844US10734312B2Packaged integrated circuit having stacked die and method for thereforNXP USA INC·Filed 2018·Granted Aug 4, 2020·0 cites·20 claims
- 2944US10249557B2Packaged integrated circuit device and methodsNXP USA INC·Filed 2017·Granted Apr 2, 2019·0 cites·20 claims
- 3044US2014367859A1Tin-based wirebond structuresFREESCALE SEMICONDUCTOR INC·Filed 2014·Application pending·0 cites
- 3143US2016064316A1Package substrate with improved reliabilityCARPENTER BURTON J·Filed 2014·Application pending·0 cites
- 3243US2008182398A1Varied Solder Mask Opening Diameters Within a Ball Grid Array SubstrateCARPENTER BURTON J·Filed 2007·Application pending·0 cites
- 3342US8802508B2Semiconductor device packageCARPENTER BURTON J·Filed 2012·Granted Aug 12, 2014·0 cites·21 claims
- 3442US8556159B2Embedded electronic componentTRAN TU-ANH N·Filed 2012·Granted Oct 15, 2013·0 cites·20 claims
- 3542US8536697B2Packaged die for heat dissipation and method thereforYUAN YUAN·Filed 2011·Granted Sep 17, 2013·0 cites·11 claims
- 3642US2014374891A1Semiconductor device with heat spreader and thermal sheetLOW BOON YEW·Filed 2013·Application pending·0 cites
- 3741US10242935B2Packaged semiconductor device and method for formingNXP USA INC·Filed 2017·Granted Mar 26, 2019·0 cites·22 claims
- 3841US2015303169A1Systems and methods for multiple ball bond structuresTRAN TU-ANH N·Filed 2014·Application pending·0 cites
- 3940US5266444AMethod and composition for obtaining image reversal in epoxy formulations based upon photoinhibitionIBM·Filed 1992·Granted Nov 30, 1993·7 cites·8 claims
- 4040US2005245059A1Method for making an interconnect padYUAN YUAN·Filed 2004·Application pending·0 cites
- 4140US2014063742A1Thermally Enhanced Electronic Component Packages with Through Mold ViasCARPENTER JR BURTON JESSE·Filed 2012·Application pending·0 cites
- 4239US10734327B2Lead reduction for improved creepage distanceNXP USA INC·Filed 2019·Granted Aug 4, 2020·0 cites·21 claims
- 4339US2004099716A1Solder joint reliability by changing solder pad surface from flat to convex shapeMOTOROLA INC·Filed 2002·Application pending·0 cites
- 4438US2007267748A1Integrated circuit having pads and input/output (i/o) cellsTRAN TU-ANH N·Filed 2006·Application pending·0 cites
- 4536US9111937B2Semiconductor devices with multilayer flex interconnect structuresFREESCALE SEMICONDUCTOR INC·Filed 2013·Granted Aug 18, 2015·0 cites·19 claims
- 4635US2002079595A1Apparatus for connecting a semiconductor die to a substrate and method thereforFiled 2000·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →