Inventor · disambiguated record
Kazunori Kitamura
Also filed as: KITAMURA KAZUNORI
11 granted patents·5 pending applications·55 citations·filing 1989–2016
86Inventor score
Files withSAN EI KAGAKU CO5KITAMURA KAZUNORI3SAN-EI KAGAKU CO LTD3JAPAN ATOMIC ENERGY RES INST1NAGARA YOSHIAKI1
Top patents by PatentIndex Score
16 records- 0181US8232477B2Curable resin composition, halogen-free resin substrate, and halogen-free build-up printed wiring boardKITAMURA KAZUNORI·Filed 2009·Granted Jul 31, 2012·6 cites·14 claims
- 0275US9072205B1Surface mounting method utilizing active resin compositionSAN EI KAGAKU CO·Filed 2015·Granted Jun 30, 2015·1 cites·12 claims
- 0366US4988130AMetal seal flange assemblyJAPAN ATOMIC ENERGY RES INST·Filed 1989·Granted Jan 29, 1991·31 cites·5 claims
- 0465US8551819B2Method for surface mounting using cleaning-free activated resinous compositionKITAMURA KAZUNORI·Filed 2011·Granted Oct 8, 2013·2 cites·13 claims
- 0557US6812299B2Composition of epoxy resin-unsaturated acid adduct, (meth)acrylate and crystallizable epoxy resinSAN EI KAGAKU CO·Filed 2002·Granted Nov 2, 2004·7 cites·14 claims
- 0654US7396885B2Photo-setting and thermosetting resin composition, process for preparing plugged-through-hole printed wiring board and plugged-through-hole printed wiring boardSAN EI KAGAKU CO·Filed 2002·Granted Jul 8, 2008·5 cites·1 claims
- 0751US2012168219A1Active resin composition, surface mounting method and printed wiring boardKITAMURA KAZUNORI·Filed 2011·Application pending·0 cites
- 0848US7410673B2Smooth board and process for preparing a smooth boardSAN EI KAGAKU CO·Filed 2004·Granted Aug 12, 2008·3 cites·16 claims
- 0944US2011031300A1Cleaning-free activated resinous composition and method for surface mounting using the sameSAN EI KAGAKU CO·Filed 2010·Application pending·0 cites
- 1043US2007188093A1Organic electroluminescent display panelNAGARA YOSHIAKI·Filed 2007·Application pending·0 cites
- 1141US8758986B2Printed wiring board and method for producing the sameSAITO TAKESHI·Filed 2010·Granted Jun 24, 2014·0 cites·7 claims
- 1240US9732183B2Method for manufacturing hole-filling printed wiring board, curable resin composition and hole-filling printed wiring boardSAN-EI KAGAKU CO LTD·Filed 2016·Granted Aug 15, 2017·0 cites·7 claims
- 1339US9415469B2Resin composition for solder bump formation, solder bump formation method, and member having solder bumpsSAN-EI KAGAKU CO LTD·Filed 2014·Granted Aug 16, 2016·0 cites·3 claims
- 1437US9565754B2Solder-mounted board, production method therefor, and semiconductor deviceSAN-EI KAGAKU CO LTD·Filed 2012·Granted Feb 7, 2017·0 cites·9 claims
- 1536US2006042832A1Multilayer circuit board and method of producing the sameSATO KIYOSHI·Filed 2004·Application pending·0 cites
- 1633US2005218803A1Organic EL device and method of manufacturing the sameTAKEUCHI KAZUYOSHI·Filed 2005·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Kazunori Kitamura files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →