Inventor · disambiguated record
Moosung Chae
Also filed as: CHAE MOOSUNG · CHAE MOOSUNG M
23 granted patents·4 pending applications·81 citations·filing 2005–2020
93Inventor score
Top patents by PatentIndex Score
27 records- 0195US9159610B2Hybrid manganese and manganese nitride barriers for back-end-of-line metallization and methods for fabricating the sameGLOBALFOUNDRIES INC·Filed 2013·Granted Oct 13, 2015·22 cites·20 claims
- 0289US9330974B2Through level vias and methods of formation thereofKIM SUNOO·Filed 2010·Granted May 3, 2016·21 cites·26 claims
- 0388US10079208B2IC structure with interface liner and methods of forming sameGLOBALFOUNDRIES INC·Filed 2016·Granted Sep 18, 2018·5 cites·15 claims
- 0487US9362228B2Electro-migration enhancing method for self-forming barrier process in copper metalizationGLOBALFOUNDRIES INC·Filed 2013·Granted Jun 7, 2016·7 cites·13 claims
- 0582US8932934B2Methods of self-forming barrier integration with pore stuffed ULK materialGLOBALFOUNDRIES INC·Filed 2013·Granted Jan 13, 2015·6 cites·13 claims
- 0680US7619310B2Semiconductor interconnect and method of making sameINFINEON TECHNOLOGIES AG·Filed 2006·Granted Nov 17, 2009·10 cites·19 claims
- 0777US9905460B2Methods of self-forming barrier formation in metal interconnection applicationsGLOBALFOUNDRIES INC·Filed 2015·Granted Feb 27, 2018·3 cites·16 claims
- 0876US9054052B2Methods for integration of pore stuffing materialGLOBALFOUNDRIES INC·Filed 2013·Granted Jun 9, 2015·3 cites·17 claims
- 0971US10784195B2Electrical fuse formation during a multiple patterning processGLOBALFOUNDRIES INC·Filed 2018·Granted Sep 22, 2020·1 cites·17 claims
- 1065US9194036B2Plasma vapor depositionKIM SUN-OO·Filed 2007·Granted Nov 24, 2015·2 cites·46 claims
- 1161US11348870B2Electrical fuse formation during a multiple patterning processGLOBALFOUNDRIES US INC·Filed 2020·Granted May 31, 2022·0 cites·20 claims
- 1259US8618635B2Capacitors in integrated circuits and methods of fabrication thereofKIM SUNOO·Filed 2010·Granted Dec 31, 2013·1 cites·36 claims
- 1355US10553478B2IC structure with interface liner and methods of forming sameGLOBALFOUNDRIES INC·Filed 2018·Granted Feb 4, 2020·0 cites·7 claims
- 1455US9425140B2Capacitors in integrated circuits and methods of fabrication thereofINFINEON TECHNOLOGIES AG·Filed 2013·Granted Aug 23, 2016·0 cites·22 claims
- 1554US10008560B2Capacitors in integrated circuits and methods of fabrication thereofINFINEON TECHNOLOGIES AG·Filed 2016·Granted Jun 26, 2018·0 cites·35 claims
- 1652US9666524B2Electro-migration enhancing method for self-forming barrier process in copper mettalizationGLOBALFOUNDRIES INC·Filed 2016·Granted May 30, 2017·0 cites·20 claims
- 1749US10043753B2Airgaps to isolate metallization featuresGLOBALFOUNDRIES INC·Filed 2016·Granted Aug 7, 2018·0 cites·20 claims
- 1849US9484252B2Integrated circuits including selectively deposited metal capping layers on copper lines and methods for fabricating the sameGLOBAL FOUNDRIES INC·Filed 2014·Granted Nov 1, 2016·0 cites·19 claims
- 1949US7713866B2Semiconductor devices and methods of manufacture thereofINFINEON TECHNOLOGIES AG·Filed 2006·Granted May 11, 2010·0 cites·21 claims
- 2047US8197660B2Electro chemical deposition systems and methods of manufacturing using the sameCHAE MOOSUNG·Filed 2007·Granted Jun 12, 2012·0 cites·20 claims
- 2144US2015255331A1Integrated circuits with a copper and manganese component and methods for producing such integrated circuitsGLOBALFOUNDRIES INC·Filed 2014·Application pending·0 cites
- 2243US8636879B2Electro chemical deposition systems and methods of manufacturing using the sameCHAE MOOSUNG·Filed 2012·Granted Jan 28, 2014·0 cites·27 claims
- 2343US2015137372A1Self forming barrier layer and method of formingGLOBALFOUNDRIES INC·Filed 2013·Application pending·0 cites
- 2442US2014353805A1Methods of semiconductor contaminant removal using supercritical fluidGLOBALFOUNDRIES INC·Filed 2013·Application pending·0 cites
- 2541US8432041B2Semiconductor devices and methods of manufacture thereofMOON BUM KI·Filed 2010·Granted Apr 30, 2013·0 cites·26 claims
- 2641US2007072413A1Methods of forming copper interconnect structures on semiconductor substratesCHOI SEUNG-MAN·Filed 2005·Application pending·0 cites
- 2738US9484297B2Semiconductor device having non-magnetic single core inductor and method of producing the sameGLOBALFOUNDRIES INC·Filed 2015·Granted Nov 1, 2016·0 cites·14 claims
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