Inventor · disambiguated record
Lai Cheng Law
Also filed as: LAW LAI CHENG
3 granted patents·3 pending applications·9 citations·filing 2012–2013
59Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0175US8927345B2Device package with rigid interconnect structure connecting die and substrate and method thereofYAP WENG FOONG·Filed 2012·Granted Jan 6, 2015·6 cites·19 claims
- 0261US8680660B1Brace for bond wireLAW LAI CHENG·Filed 2013·Granted Mar 25, 2014·3 cites·20 claims
- 0339US8741666B1Methods relating to intermetallic testing of bond integrity between bond pads and copper-containing bond wiresYAP WENG F·Filed 2013·Granted Jun 3, 2014·0 cites·20 claims
- 0435US2013341378A1System and method for inspecting free air ballLEE SEOK KHOON·Filed 2012·Application pending·0 cites
- 0529US2014374467A1Capillary bonding tool and method of forming wire bondsYAP JIA LIN·Filed 2013·Application pending·0 cites
- 0628US2013319726A1Multi-core wireSIONG CHIN TECK·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →