Inventor · disambiguated record
Wim Besling
Also filed as: BESLING WIM
5 granted patents·2 pending applications·44 citations·filing 2005–2011
79Inventor score
Top patents by PatentIndex Score
7 records- 0183US7867889B2Method of forming an interconnect structure on an integrated circuit dieNXP BV·Filed 2005·Granted Jan 11, 2011·15 cites·8 claims
- 0282US7928006B2Structure for a semiconductor device and a method of manufacturing the sameNXP BV·Filed 2006·Granted Apr 19, 2011·14 cites·24 claims
- 0376US8138082B2Method for forming metal interconnects in a dielectric materialTORRES JOAQUIN·Filed 2007·Granted Mar 20, 2012·8 cites·19 claims
- 0472US8830656B2High density capacitorBESLING WIM·Filed 2011·Granted Sep 9, 2014·3 cites·20 claims
- 0569US8349726B2Method for fabricating a structure for a semiconductor device using a halogen based precursorNXP BV·Filed 2006·Granted Jan 8, 2013·4 cites·24 claims
- 0641US2009197405A1Method of forming a layer over a surface of a first material embedded in a second material in a structure for a semiconductor deviceNXP BV·Filed 2006·Application pending·0 cites
- 0739US2008311739A1Method of Forming a Self Aligned Copper Capping LayerNXP BV·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →