Inventor · disambiguated record

Dorreen Jane Ossenkop

Also filed as: OSSENKOP DORREEN J · OSSENKOP DORREEN JANE

2 granted patents·33 citations·filing 2008–2008

59Inventor score

Technology areasH10W

Files withIBM2

Top patents by PatentIndex Score

2 records

0192US7741226B2Optimal tungsten through wafer via and process of fabricating sameIBM·Filed 2008·Granted Jun 22, 2010·31 cites·22 claims
0262US7863180B2Through substrate via including variable sidewall profileIBM·Filed 2008·Granted Jan 4, 2011·2 cites·13 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →