Inventor · disambiguated record
Nghia Thuc Tu
Also filed as: TU NGHIA · TU NGHIA T · TU NGHIA THUC
20 granted patents·5 pending applications·242 citations·filing 2002–2012
94Inventor score
Files withNAT SEMICONDUCTOR CORP18TEXAS INSTRUMENTS INC2BAYAN JAIME A1PODDAR ANINDYA1PODDAR ANINYDA1
Top patents by PatentIndex Score
25 records- 0194US6723585B1Leadless packageNAT SEMICONDUCTOR CORP·Filed 2002·Granted Apr 20, 2004·111 cites·14 claims
- 0289US7836586B2Thin foil semiconductor packageNAT SEMICONDUCTOR CORP·Filed 2008·Granted Nov 23, 2010·15 cites·11 claims
- 0385US7846775B1Universal lead frame for micro-array packagesNAT SEMICONDUCTOR CORP·Filed 2005·Granted Dec 7, 2010·15 cites·13 claims
- 0485US7671452B1Microarray package with plated contact pedestalsNAT SEMICONDUCTOR CORP·Filed 2007·Granted Mar 2, 2010·10 cites·4 claims
- 0584US7419855B1Apparatus and method for miniature semiconductor packagesNAT SEMICONDUCTOR CORP·Filed 2006·Granted Sep 2, 2008·11 cites·18 claims
- 0681US6933212B1Apparatus and method for dicing semiconductor wafersNAT SEMICONDUCTOR CORP·Filed 2004·Granted Aug 23, 2005·25 cites·19 claims
- 0780US7161232B1Apparatus and method for miniature semiconductor packagesNAT SEMICONDUCTOR CORP·Filed 2004·Granted Jan 9, 2007·26 cites·15 claims
- 0879US7491625B2Gang flipping for IC packagingNAT SEMICONDUCTOR CORP·Filed 2007·Granted Feb 17, 2009·9 cites·13 claims
- 0976US7598122B1Die attach method and microarray leadframe structureNAT SEMICONDUCTOR CORP·Filed 2006·Granted Oct 6, 2009·7 cites·5 claims
- 1075US8101470B2Foil based semiconductor packagePODDAR ANINDYA·Filed 2009·Granted Jan 24, 2012·7 cites·19 claims
- 1162US7859090B2Die attach method and leadframe structureNAT SEMICONDUCTOR CORP·Filed 2009·Granted Dec 28, 2010·2 cites·8 claims
- 1261US8298871B2Method and leadframe for packaging integrated circuitsWONG WILL K·Filed 2011·Granted Oct 30, 2012·2 cites·12 claims
- 1358US8375577B2Method of making foil based semiconductor packageNAT SEMICONDUCTOR CORP·Filed 2008·Granted Feb 19, 2013·1 cites·11 claims
- 1453US8857047B2Thin foil semiconductor packageTEXAS INSTRUMENTS INC·Filed 2012·Granted Oct 14, 2014·0 cites·6 claims
- 1553US8377267B2Foil plating for semiconductor packagingNAT SEMICONDUCTOR CORP·Filed 2009·Granted Feb 19, 2013·0 cites·11 claims
- 1650US2009160039A1Method and leadframe for packaging integrated circuitsNAT SEMICONDUCTOR CORP·Filed 2007·Application pending·0 cites
- 1749US8747640B2Foil plating for semiconductor packagingTEXAS INSTRUMENTS INC·Filed 2012·Granted Jun 10, 2014·0 cites·4 claims
- 1849US8341828B2Thin foil semiconductor packageNAT SEMICONDUCTOR CORP·Filed 2010·Granted Jan 1, 2013·0 cites·5 claims
- 1949US7893523B2Microarray package with plated contact pedestalsNAT SEMICONDUCTOR CORP·Filed 2010·Granted Feb 22, 2011·0 cites·11 claims
- 2048US8293573B2Microarray package with plated contact pedestalsBAYAN JAIME A·Filed 2010·Granted Oct 23, 2012·0 cites·17 claims
- 2148US2010084748A1Thin foil for use in packaging integrated circuitsNAT SEMICONDUCTOR CORP·Filed 2009·Application pending·0 cites
- 2246US8389334B2Foil-based method for packaging intergrated circuitsPODDAR ANINYDA·Filed 2010·Granted Mar 5, 2013·1 cites·10 claims
- 2344US2008290482A1Method of packaging integrated circuitsNAT SEMICONDUCTOR CORP·Filed 2007·Application pending·0 cites
- 2434US2011269269A1Laser ablation alternative to low cost leadframe processNAT SEMICONDUCTOR CORP·Filed 2010·Application pending·0 cites
- 2531US2012074561A1Backmetal replacement for use in the packaging of integrated circuitsTU NGHIA T·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →