Inventor · disambiguated record
Te-Sheng Yang
Also filed as: YANG TE-SHENG
7 granted patents·6 pending applications·428 citations·filing 1998–2025
88Inventor score
Top patents by PatentIndex Score
13 records- 0191US6204562B1Wafer-level chip scale packageUNITED MICROELECTRONICS CORP·Filed 1999·Granted Mar 20, 2001·162 cites·10 claims
- 0291US6043109AMethod of fabricating wafer-level packageUNITED MICROELECTRONICS CORP·Filed 1999·Granted Mar 28, 2000·148 cites·17 claims
- 0381US6291881B1Dual silicon chip packageUNITED MICROELECTRONICS CORP·Filed 1999·Granted Sep 18, 2001·71 cites·3 claims
- 0473US6399421B2Dual-dies packaging structure and packaging methodUNITED MICROELECTRONICS CORP·Filed 2001·Granted Jun 4, 2002·18 cites·9 claims
- 0562US2025355281A1Smart contact lens and method of fabricating the samePEGAVISION CORP·Filed 2025·Application pending·0 cites
- 0659US6545350B2Integrated circuit packages and the method for the sameUNITED MICROELECTRONICS CORP·Filed 2001·Granted Apr 8, 2003·8 cites·8 claims
- 0758US6313527B1Dual-dies packaging structure and packaging methodUNITED MICROELECTRONICS CORP·Filed 1998·Granted Nov 6, 2001·21 cites·14 claims
- 0845US2009000808A1Flexible Printed Circuit Board And Method Of Fabricating The SameYANG TE-SHENG·Filed 2007·Application pending·0 cites
- 0939US6846697B2Integrated circuit packages and the method for making the sameUNITED MICROELECTRONICS CORP·Filed 2002·Granted Jan 25, 2005·0 cites·24 claims
- 1027US2002053450A1Wafer-level packageFiled 1999·Application pending·0 cites
- 1127US2001052632A1Semiconductor package with an electrical static discharge resistorFiled 1999·Application pending·0 cites
- 1227US2001050420A1Leadframe having joined internal leadFiled 1999·Application pending·0 cites
- 1326US2003002264A1Manufacturing method for a flexible PCBUFLEX TECHNOLOGY CO LTD·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →