Inventor · disambiguated record
Margaret A. Szymanowski
Also filed as: SZYMANOWSKI MARGARET · SZYMANOWSKI MARGARET A
29 granted patents·1 pending application·183 citations·filing 2008–2020
96Inventor score
Top patents by PatentIndex Score
30 records- 0198US11522499B2Integrated multiple-path power amplifierNXP USA INC·Filed 2020·Granted Dec 6, 2022·14 cites·20 claims
- 0298US9774301B1Multiple-path RF amplifiers with angularly offset signal path directions, and methods of manufacture thereofFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Sep 26, 2017·49 cites·20 claims
- 0395US9647611B1Reconfigurable power splitters and amplifiers, and corresponding methodsFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted May 9, 2017·22 cites·20 claims
- 0495US9450547B2Semiconductor package having an isolation wall to reduce electromagnetic couplingFREESCALE SEMICONDUCTOR INC·Filed 2013·Granted Sep 20, 2016·18 cites·33 claims
- 0593US9978691B2Semiconductor packages having wire bond wall to reduce couplingFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted May 22, 2018·8 cites·12 claims
- 0692US11018629B2Integrated multiple-path power amplifierNXP USA INC·Filed 2019·Granted May 25, 2021·12 cites·22 claims
- 0788US10587226B2Amplifier device with harmonic termination circuitNXP USA INC·Filed 2018·Granted Mar 10, 2020·7 cites·25 claims
- 0887US9589927B2Packaged RF amplifier devices with grounded isolation structures and methods of manufacture thereofFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Mar 7, 2017·12 cites·20 claims
- 0983US10069462B1Multiple-stage RF amplifier devicesNXP USA INC·Filed 2017·Granted Sep 4, 2018·6 cites·9 claims
- 1083US7998852B2Methods for forming an RF device with trench under bond pad featureFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted Aug 16, 2011·10 cites·20 claims
- 1180US11108362B2Multiple-path RF amplifiers with angularly offset signal path directions, and methods of manufacture thereofNXP USA INC·Filed 2020·Granted Aug 31, 2021·1 cites·22 claims
- 1279US9673164B2Semiconductor package and system with an isolation structure to reduce electromagnetic couplingFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Jun 6, 2017·5 cites·26 claims
- 1378US11223336B2Power amplifier integrated circuit with integrated shunt-l circuit at amplifier outputNXP USA INC·Filed 2020·Granted Jan 11, 2022·1 cites·20 claims
- 1476US9401342B2Semiconductor package having wire bond wall to reduce couplingMEEN KUO SHUN·Filed 2013·Granted Jul 26, 2016·8 cites·26 claims
- 1572US9240390B2Semiconductor packages having wire bond wall to reduce couplingFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Jan 19, 2016·2 cites·16 claims
- 1671US10110170B2Semiconductor package having an isolation wall to reduce electromagnetic couplingFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Oct 23, 2018·1 cites·14 claims
- 1767US9337774B2Packaged RF amplifier devices and methods of manufacture thereofFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted May 10, 2016·3 cites·20 claims
- 1864US9331642B2Monolithic transistor circuits with tapered feedback resistors, RF amplifier devices, and methods of manufacture thereofMUSA SARMAD K·Filed 2014·Granted May 3, 2016·3 cites·29 claims
- 1960US10630243B2Semiconductor package having an isolation wall to reduce electromagnetic couplingNXP USA INC·Filed 2019·Granted Apr 21, 2020·0 cites·20 claims
- 2060US10476442B2Semiconductor package having an isolation wall to reduce electromagnetic couplingNXP USA INC·Filed 2018·Granted Nov 12, 2019·0 cites·14 claims
- 2158US10269729B2Semiconductor packages having wire bond wall to reduce couplingNXP USA INC·Filed 2018·Granted Apr 23, 2019·0 cites·21 claims
- 2254US10566935B2Multiple-path RF amplifiers with angularly offset signal path directions, and methods of manufacture thereofNXP USA INC·Filed 2017·Granted Feb 18, 2020·0 cites·22 claims
- 2354US8890339B1Self-defining, low capacitance wire bond padSANTOS FERNANDO A·Filed 2013·Granted Nov 18, 2014·1 cites·15 claims
- 2453US11190145B2Power amplifier with integrated bias circuit having multi-point inputNXP USA INC·Filed 2019·Granted Nov 30, 2021·0 cites·15 claims
- 2548US11277119B2Digital step attenuator and method for operating a digital step attenuatorNXP USA INC·Filed 2020·Granted Mar 15, 2022·0 cites·16 claims
- 2648US11159134B2Multiple-stage power amplifiers and amplifier arrays configured to operate using the same output bias voltageNXP USA INC·Filed 2019·Granted Oct 26, 2021·0 cites·22 claims
- 2747US11277098B2Integrally-formed multiple-path power amplifier with on-die combining node structureNXP USA INC·Filed 2019·Granted Mar 15, 2022·0 cites·20 claims
- 2847US8134241B2Electronic elements and devices with trench under bond pad featureJONES JEFFREY K·Filed 2011·Granted Mar 13, 2012·0 cites·20 claims
- 2940US10211784B2Amplifier architecture reconfigurationFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Feb 19, 2019·0 cites·19 claims
- 3039US2020098684A1Transistor, packaged device, and method of fabricationNXP USA INC·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →