Inventor · disambiguated record

Wei-Chiao Wang

Also filed as: WANG WEI-CHIAO

3 granted patents·2 pending applications·2 citations·filing 2022–2024

49Inventor score

Technology areasH10W

Files withGLOBAL UNICHIP CORP5

Top patents by PatentIndex Score

5 records

0187US11869846B1Interposer routing structure and semiconductor packageGLOBAL UNICHIP CORP·Filed 2023·Granted Jan 9, 2024·2 cites·20 claims
0256US2025385191A1Semiconductor package device and semiconductor wiring substrate thereofGLOBAL UNICHIP CORP·Filed 2024·Application pending·0 cites
0355US2025226330A1Semiconductor package device and semiconductor wiring substrate thereofGLOBAL UNICHIP CORP·Filed 2024·Application pending·0 cites
0453US11869845B2Semiconductor package device and semiconductor wiring substrate thereofGLOBAL UNICHIP CORP·Filed 2022·Granted Jan 9, 2024·0 cites·20 claims
0549US12506057B2Interposer device and semiconductor package structureGLOBAL UNICHIP CORP·Filed 2023·Granted Dec 23, 2025·0 cites·20 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →