Inventor · disambiguated record
Thomas P. Gall
Also filed as: GALL THOMAS · GALL THOMAS P · GALL THOMAS PATRICK
26 granted patents·1 pending application·876 citations·filing 1990–2013
97Inventor score
Top patents by PatentIndex Score
27 records- 0194US6927344B1Flexible circuit board assemblyMOTOROLA INC·Filed 2004·Granted Aug 9, 2005·100 cites·17 claims
- 0294US5185073AMethod of fabricating nendritic materialsIBM·Filed 1991·Granted Feb 9, 1993·173 cites·4 claims
- 0393US6483037B1Multilayer flexible FR4 circuitMOTOROLA INC·Filed 2001·Granted Nov 19, 2002·75 cites·23 claims
- 0491US5137461ASeparable electrical connection technologyIBM·Filed 1990·Granted Aug 11, 1992·134 cites·8 claims
- 0585US6501661B1Electronic control unitMOTOROLA INC·Filed 2001·Granted Dec 31, 2002·36 cites·19 claims
- 0684US5734560ACap providing flat surface for DCA and solder ball attach and for sealing plated through holes, multi-layer electronic sturctures including the capIBM·Filed 1996·Granted Mar 31, 1998·54 cites·14 claims
- 0784US5391514ALow temperature ternary C4 flip chip bonding methodIBM·Filed 1994·Granted Feb 21, 1995·79 cites·6 claims
- 0875US7075794B2Electronic control unitMOTOROLA INC·Filed 2003·Granted Jul 11, 2006·22 cites·18 claims
- 0972US5659951AMethod for making printed circuit board with flush surface landsIBM·Filed 1996·Granted Aug 26, 1997·31 cites·17 claims
- 1068US5442144AMultilayered circuit boardIBM·Filed 1994·Granted Aug 15, 1995·25 cites·7 claims
- 1166US5359767AMethod of making multilayered circuit boardIBM·Filed 1993·Granted Nov 1, 1994·24 cites·13 claims
- 1265US5679444AMethod for producing multi-layer circuit board and resulting article of manufactureIBM·Filed 1996·Granted Oct 21, 1997·21 cites·5 claims
- 1358US8876122B2Level control for vehicles having at least one air springAMK ARNOLD MÜLLER GMBH & CO KG·Filed 2013·Granted Nov 4, 2014·5 cites·22 claims
- 1456US7570492B2Apparatus for venting an electronic control moduleTEMIC AUTOMOTIVE NA INC·Filed 2004·Granted Aug 4, 2009·7 cites·9 claims
- 1552US6749105B2Method and apparatus for securing a metallic substrate to a metallic housingMOTOROLA INC·Filed 2002·Granted Jun 15, 2004·4 cites·13 claims
- 1652US6594891B1Process for forming multi-layer electronic structuresIBM·Filed 2000·Granted Jul 22, 2003·3 cites·7 claims
- 1749US5709805AMethod for producing multi-layer circuit board and resulting article of manufactureIBM·Filed 1996·Granted Jan 20, 1998·11 cites·14 claims
- 1848US5379193AParallel processor structure and packageIBM·Filed 1993·Granted Jan 3, 1995·14 cites·2 claims
- 1946US5403420AFabrication tool and method for parallel processor structure and packageIBM·Filed 1993·Granted Apr 4, 1995·15 cites·9 claims
- 2046US5374344AMethod and apparatus for electrodeposition of a metallurgically bondable circuitized flexible substrateIBM·Filed 1993·Granted Dec 20, 1994·13 cites·5 claims
- 2144US5773195ACap providing flat surface for DCA and solder ball attach and for sealing plated through holes, multi-layer electronic structures including the cap, and a process of forming the cap and for forming multi-layer electronic structures including the capIBM·Filed 1995·Granted Jun 30, 1998·9 cites·11 claims
- 2243US6098280AProcess for forming multi-layer electronic structures including a cap for providing a flat surface for DCA and solder ball attach and for sealing plated through holesIBM·Filed 1998·Granted Aug 8, 2000·8 cites·18 claims
- 2338US7300820B2Adhesive assembly for a circuit boardTEMIC AUTOMOTIVE NA INC·Filed 2004·Granted Nov 27, 2007·0 cites·12 claims
- 2436US5363553AMethod of drilling vias and through holesIBM·Filed 1993·Granted Nov 15, 1994·7 cites·1 claims
- 2536US5347710AParallel processor and method of fabricationIBM·Filed 1993·Granted Sep 20, 1994·6 cites·14 claims
- 2634US2003095388A1Method and apparatus for securing a circuit board to a rigid surfaceFiled 2001·Application pending·0 cites
- 2729US7353983B2Vertical removal of excess solder from a circuit substrateTEMIC AUTOMOTIVE NA INC·Filed 2003·Granted Apr 8, 2008·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →