Inventor · disambiguated record
Dae Hong Eom
Also filed as: EOM DAE HONG
5 granted patents·7 pending applications·26 citations·filing 2001–2025
74Inventor score
Top patents by PatentIndex Score
12 records- 0190US8664101B2Multiple mold structure methods of manufacturing vertical memory devicesKIM HYO-JUNG·Filed 2012·Granted Mar 4, 2014·17 cites·20 claims
- 0271US8110499B2Method of forming a contact structureKANG DAE-HYUK·Filed 2009·Granted Feb 7, 2012·5 cites·15 claims
- 0369US12133383B2Memory cell and method used in forming a memory cellsMICRON TECHNOLOGY INC·Filed 2023·Granted Oct 29, 2024·0 cites·9 claims
- 0468US8765551B2Non-volatile memory device having vertical structure and method of manufacturing the sameYANG JUN-YOUL·Filed 2012·Granted Jul 1, 2014·4 cites·21 claims
- 0563US2025344390A1Continuity in memory arraysMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0660US11856766B2Memory cell having programmable material comprising at least two regions comprising SiNxMICRON TECHNOLOGY INC·Filed 2021·Granted Dec 26, 2023·0 cites·30 claims
- 0746US2009025755A1Method for treating substrateSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 0841US2015214079A1Wet stationSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 0940US2023018127A1Microelectronic devices with channel sub-regions of differing microstructures, and related methods and systemsMICRON TECHNOLOGY INC·Filed 2021·Application pending·0 cites
- 1040US2015155297A1Methods of fabricating semiconductor devices having double-layered blocking insulating layersEOM DAE-HONG·Filed 2014·Application pending·0 cites
- 1136US2011287625A1Methods of forming a pattern, methods of forming a gate structure and methods of manufacturing a semiconductor device using the sameKANG DAE-HYUK·Filed 2011·Application pending·0 cites
- 1229US2003116174A1Semiconductor wafer cleaning apparatus and cleaning method using the sameFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →