Inventor · disambiguated record
Hung-Ping Lee
Also filed as: LEE HUNG-PING
7 granted patents·5 pending applications·9 citations·filing 2013–2023
75Inventor score
Files withJ METRICS TECH CO LTD6SONICMEMS ZHENGZHOU TECH CO LTD4ANPEC ELECTRONICS CORP1MACROBLOCK INC1
Top patents by PatentIndex Score
12 records- 0190US11075072B2Wafer scale ultrasonic sensing device and manufacturing method thereofJ METRICS TECH CO LTD·Filed 2020·Granted Jul 27, 2021·3 cites·11 claims
- 0282US11460341B2Wafer scale ultrasonic sensor assembly and method for manufacturing the sameJ METRICS TECH CO LTD·Filed 2019·Granted Oct 4, 2022·3 cites·20 claims
- 0379US11806751B2Wafer level ultrasonic device and manufacturing method thereofJ METRICS TECH CO LTD·Filed 2020·Granted Nov 7, 2023·1 cites·4 claims
- 0474US2024009703A1Wafer level ultrasonic deviceSONICMEMS ZHENGZHOU TECH CO LTD·Filed 2023·Application pending·0 cites
- 0574US2024009702A1Manufacturing method of wafer level ultrasonic deviceSONICMEMS ZHENGZHOU TECH CO LTD·Filed 2023·Application pending·0 cites
- 0672US10120634B2LED display deviceANPEC ELECTRONICS CORP·Filed 2016·Granted Nov 6, 2018·2 cites·10 claims
- 0765US2023014827A1Wafer level ultrasonic chip module having suspension structureJ METRICS TECH CO LTD·Filed 2022·Application pending·0 cites
- 0851US11478822B2Wafer level ultrasonic chip module having suspension structure and manufacturing method thereofJ METRICS TECH CO LTD·Filed 2019·Granted Oct 25, 2022·0 cites·7 claims
- 0948US11548031B2Array-type ultrasonic sensorSONICMEMS ZHENGZHOU TECH CO LTD·Filed 2021·Granted Jan 10, 2023·0 cites·9 claims
- 1041US2014048828A1Led display panel and led display apparatusMACROBLOCK INC·Filed 2013·Application pending·0 cites
- 1138US2020203319A1Mass transfer method for micro light emitting diode and light emitting panel module using thereofJ METRICS TECH CO LTD·Filed 2019·Application pending·0 cites
- 1236US11590536B2Wafer level ultrasonic chip module and manufacturing method thereofSONICMEMS ZHENGZHOU TECH CO LTD·Filed 2019·Granted Feb 28, 2023·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →