Inventor · disambiguated record
Jin-Kwon Bae
Also filed as: BAE JIN-KWON
10 granted patents·1 pending application·67 citations·filing 2010–2021
87Inventor score
Files withSAMSUNG ELECTRONICS CO LTD4KIM JAE-CHOON2BAE JIN-KWON1BAEK JOONG-HYUN1HYUNDAI MOBIS CO LTD1
Top patents by PatentIndex Score
11 records- 0193US9671141B2Thermoelectric cooling packages and thermal management methods thereofSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jun 6, 2017·9 cites·20 claims
- 0293US9228763B2Thermoelectric cooling packages and thermal management methods thereofKIM JAE CHOON·Filed 2012·Granted Jan 5, 2016·18 cites·13 claims
- 0392US8184439B2Semiconductor moduleBAEK JOONG-HYUN·Filed 2010·Granted May 22, 2012·21 cites·16 claims
- 0489US10658266B2Thermoelectric cooling packages and thermal management methods thereofSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 19, 2020·3 cites·15 claims
- 0583US9391009B2Semiconductor packages including heat exhaust partJANG EON SOO·Filed 2014·Granted Jul 12, 2016·10 cites·19 claims
- 0667US11688897B2Battery apparatus and method for detecting thermal runaway of vehicle batteryHYUNDAI MOBIS CO LTD·Filed 2021·Granted Jun 27, 2023·0 cites·6 claims
- 0762US9651431B2Semiconductor package and method of estimating surface temperature of semiconductor device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted May 16, 2017·2 cites·14 claims
- 0859US9202773B2Semiconductor module and module system having the sameBAE JIN-KWON·Filed 2012·Granted Dec 1, 2015·2 cites·19 claims
- 0958US8994169B2Semiconductor packages usable with a mobile deviceKIM JI-CHUL·Filed 2012·Granted Mar 31, 2015·2 cites·21 claims
- 1043US9679874B2Semiconductor package and semiconductor device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jun 13, 2017·0 cites·12 claims
- 1136US2014239434A1Semiconductor packageKIM JAE CHOON·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →