Inventor · disambiguated record
Hyeongno Kim
Also filed as: KIM HYEONGNO
5 granted patents·5 pending applications·374 citations·filing 2001–2010
84Inventor score
Files withADVANCED SEMICONDUCTOR ENG10
Top patents by PatentIndex Score
10 records- 0194US6489218B1Singulation method used in leadless packaging processADVANCED SEMICONDUCTOR ENG·Filed 2001·Granted Dec 3, 2002·150 cites·15 claims
- 0293US7576415B2EMI shielded semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Aug 18, 2009·126 cites·9 claims
- 0388US7087461B2Process and lead frame for making leadless semiconductor packagesADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Aug 8, 2006·71 cites·20 claims
- 0475US7169651B2Process and lead frame for making leadless semiconductor packagesADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Jan 30, 2007·26 cites·22 claims
- 0555US7566962B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Jul 28, 2009·1 cites·13 claims
- 0641US2009127682A1Chip package structure and method of fabricating the sameADVANCED SEMICONDUCTOR ENG·Filed 2007·Application pending·0 cites
- 0734US2011259840A1Semiconductor package magazineADVANCED SEMICONDUCTOR ENG·Filed 2010·Application pending·0 cites
- 0834US2008237821A1Package structure and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2007·Application pending·0 cites
- 0934US2008197468A1Package structure and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2007·Application pending·0 cites
- 1034US2008237820A1Package structure and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →