Inventor · disambiguated record
Jacob Jeng
Also filed as: JENG JACOB
2 granted patents·47 citations·filing 1998–1998
64Inventor score
Technology areasH10W
Files withAMIC TECHNOLOGY INC2
Top patents by PatentIndex Score
2 records- 0160US6133067AArchitecture for dual-chip integrated circuit package and method of manufacturing the sameAMIC TECHNOLOGY INC·Filed 1998·Granted Oct 17, 2000·29 cites·18 claims
- 0248US6200828B1Integrated circuit package architecture with a variable dispensed compound and method of manufacturing the sameAMIC TECHNOLOGY INC·Filed 1998·Granted Mar 13, 2001·18 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →