Inventor · disambiguated record
Jin-Wei You
Also filed as: YOU JIN-WEI
4 granted patents·1 pending application·0 citations·filing 2015–2020
54Inventor score
Top patents by PatentIndex Score
5 records- 0153US10764995B2Fabrication method of substrate structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Sep 1, 2020·0 cites·9 claims
- 0250US11143549B2Electronic packaging structure and method for manufacturing the electronic packaging structure with optical guide die separate from electronic package and photonic dieSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2019·Granted Oct 12, 2021·0 cites·14 claims
- 0349US9907161B2Substrate structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Feb 27, 2018·0 cites·5 claims
- 0440US11443994B2Electronic package, electronic packaging module having the electronic package, and method for fabricating the electronic packageSILICONWAR E PR ECISION IND CO LT D·Filed 2020·Granted Sep 13, 2022·0 cites·20 claims
- 0528US2018139844A1Electronic device, method for fabricating an electronic device, and substrate structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Jin-Wei You files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →