Inventor · disambiguated record
Dejiang Chang
Also filed as: CHANG DEJIANG
3 granted patents·1 citations·filing 2015–2021
53Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0167US12080660B2Package with different types of semiconductor dies attached to a flangeCREE INC·Filed 2021·Granted Sep 3, 2024·0 cites·26 claims
- 0262US9997476B2Multi-die package having different types of semiconductor dies attached to the same thermally conductive flangeINFINEON TECHNOLOGIES AG·Filed 2015·Granted Jun 12, 2018·1 cites·12 claims
- 0354US11004808B2Package with different types of semiconductor dies attached to a flangeCREE INC·Filed 2018·Granted May 11, 2021·0 cites·22 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →