Inventor · disambiguated record
Jürgen Leib
Also filed as: LEIB JUERGEN · LEIB JURGEN · LEIB JÜRGEN
21 granted patents·5 pending applications·372 citations·filing 2002–2010
96Inventor score
Top patents by PatentIndex Score
26 records- 0195US7285834B2Process for producing microelectromechanical components and a housed microelectromechanical componentSCHOTT AG·Filed 2006·Granted Oct 23, 2007·39 cites·40 claims
- 0294US6911392B2Process for making contact with and housing integrated circuitsSCHOTT GLAS·Filed 2002·Granted Jun 28, 2005·76 cites·61 claims
- 0389US6894358B2Process for producing microelectromechanical components and a housed microelectromechanical componentSCHOTT GLAS·Filed 2002·Granted May 17, 2005·61 cites·46 claims
- 0486US8742588B2Method for making via interconnectionNILSSON PETER·Filed 2009·Granted Jun 3, 2014·17 cites·17 claims
- 0586US7160478B2Method for producing electronic componetsSCHOTT AG·Filed 2002·Granted Jan 9, 2007·43 cites·43 claims
- 0685US8966748B2Method for manufacturing an arrangement with a component on a carrier substrate and a method for manufacturing a semi-finished productLEIB JÜRGEN·Filed 2010·Granted Mar 3, 2015·16 cites·10 claims
- 0781US7396741B2Method for connecting substrate and composite elementSCHOTT AG·Filed 2003·Granted Jul 8, 2008·21 cites·19 claims
- 0881US7071521B2Process for producing microelectromechanical components and a housed microelectromechanical componentSCHOTT AG·Filed 2004·Granted Jul 4, 2006·36 cites·42 claims
- 0976US7495348B2Process for producing copy protection for an electronic circuitSCHOTT AG·Filed 2003·Granted Feb 24, 2009·14 cites·35 claims
- 1074US8349707B2Process for making contact with and housing integrated circuitsWAFER LEVEL PACKAGING PORTFOLIO LLC·Filed 2010·Granted Jan 8, 2013·3 cites·11 claims
- 1172US7880179B2Process for making contact with and housing integrated circuitsWAFER LEVEL PACKAGING PORTFOLIO LLC·Filed 2009·Granted Feb 1, 2011·4 cites·22 claims
- 1272US7786002B2Method for producing a component comprising a conductor structure that is suitable for use at high frequenciesSCHOTT AG·Filed 2003·Granted Aug 31, 2010·12 cites·21 claims
- 1371US7700957B2Process for making contact with and housing integrated circuitsSCHOTT AG·Filed 2004·Granted Apr 20, 2010·11 cites·6 claims
- 1468US7821106B2Process for making contact with and housing integrated circuitsSCHOTT AG·Filed 2008·Granted Oct 26, 2010·2 cites·9 claims
- 1565US7326446B2Method for coating metal surfaces and substrate having a coated metal surfaceSCHOTT AG·Filed 2003·Granted Feb 5, 2008·7 cites·22 claims
- 1659US7825029B2Method for the production of structured layers on substratesSCHOTT AG·Filed 2003·Granted Nov 2, 2010·4 cites·38 claims
- 1758US8114304B2Method for producing electronic componentsLEIB JUERGEN·Filed 2006·Granted Feb 14, 2012·1 cites·3 claims
- 1856US10954591B2Method for producing a structured coating on a substrate, coated substrate, and semi-finished product having a coated substrateLEIB JUERGEN·Filed 2010·Granted Mar 23, 2021·1 cites·14 claims
- 1955US8273671B2Glass material for radio-frequency applicationsLEIB JUERGEN·Filed 2003·Granted Sep 25, 2012·3 cites·22 claims
- 2052US7863200B2Process of vapor depositing glass layers for wafer-level hermetic encapsulation of electronic modulesSCHOTT AG·Filed 2003·Granted Jan 4, 2011·1 cites·26 claims
- 2147US2008053373A1Coating Installation Suitable For Clean Room ConditionsSCHOTT AG·Filed 2005·Application pending·0 cites
- 2247US2007251458A1Cleanroom-Capable Coating SystemSCHOTT AG·Filed 2005·Application pending·0 cites
- 2344US2010130246A1Method and Apparatus for Producing Hybrid LensesSCHOTT AG·Filed 2005·Application pending·0 cites
- 2442US8659206B2Method for producing a dielectric layer in an electroacoustic component, and electroacoustic componentHANSEN ULLI·Filed 2009·Granted Feb 25, 2014·0 cites·9 claims
- 2536US2006051584A1Process for producing a product having a structured surfaceBIECK FLORIAN·Filed 2003·Application pending·0 cites
- 2627US2008144006A1Method for Measuring Topographic Structures on DevicesSCHOTT AG·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →