Inventor · disambiguated record
Ren-Long Kuo
Also filed as: KUO REN · KUO REN-LONG
9 granted patents·57 citations·filing 2001–2011
86Inventor score
Top patents by PatentIndex Score
9 records- 0192US8481343B2Manufacturing method of molded image sensor packaging structure with predetermined focal length and the structure using the sameHSIN CHUNG-HSIEN·Filed 2010·Granted Jul 9, 2013·20 cites·7 claims
- 0279US8441086B2Image sensor packaging structure with predetermined focal lengthTU HSIU-WEN·Filed 2010·Granted May 14, 2013·6 cites·4 claims
- 0379US8390087B2Image sensor package structure with large air cavityTU HSIU-WEN·Filed 2010·Granted Mar 5, 2013·7 cites·13 claims
- 0473US8928104B2Image sensor packaging structure with black encapsulantTU HSIU-WEN·Filed 2010·Granted Jan 6, 2015·4 cites·12 claims
- 0570US8093674B2Manufacturing method for molding image sensor package structure and image sensor package structure thereofTU HSIU-WEN·Filed 2009·Granted Jan 10, 2012·5 cites·11 claims
- 0668US6632037B2Keyboard assembly with positioning functionSILITEK CORP·Filed 2001·Granted Oct 14, 2003·11 cites·11 claims
- 0767US8847146B2Image sensor package structure with casing including a vent without sealing and in communication with package materialTU HSIU-WEN·Filed 2009·Granted Sep 30, 2014·4 cites·7 claims
- 0845US8828777B2Wafer level image sensor packaging structure and manufacturing method of the sameTU HSIU-WEN·Filed 2011·Granted Sep 9, 2014·0 cites·16 claims
- 0945US8378441B2Manufacturing method and structure of a wafer level image sensor module with package structureKINGPAK TECH INC·Filed 2011·Granted Feb 19, 2013·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →