Inventor · disambiguated record
Motoki Yonekura
Also filed as: YONEKURA MOTOKI
3 granted patents·5 pending applications·0 citations·filing 2016–2025
44Inventor score
Top patents by PatentIndex Score
8 records- 0176US2024383035A1Electronic component and method for manufacturing electronic componentRESONAC CORP·Filed 2024·Application pending·0 cites
- 0270US2025293091A1Method for producing substrate having through-silicon vias, substrate having through-silicon vias, and copper paste for through-silicon via formationRESONAC CORP·Filed 2025·Application pending·0 cites
- 0359US2023391983A1PasteSHOWA DENKO MATERIALS CO LTD·Filed 2021·Application pending·0 cites
- 0458US12070800B2Electronic component and method for manufacturing electronic componentSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted Aug 27, 2024·0 cites·6 claims
- 0553US12354914B2Method for producing substrate having through-silicon vias, substrate having through-silicon vias, and copper paste for through-silicon via formationSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted Jul 8, 2025·0 cites·13 claims
- 0649US11512214B2Composition containing organic solvents with different vapor pressures, conductor made from composition, method for manufacturing conductor, and structure comprising conductorHITACHI CHEMICAL CO LTD·Filed 2018·Granted Nov 29, 2022·0 cites·17 claims
- 0746US2024224413A1Wiring substrateRESONAC CORP·Filed 2021·Application pending·0 cites
- 0833US2018029121A1Copper-containing particles, conductor-forming composition, method of producing conductior, conductor, and apparatusHITACHI CHEMICAL CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →