Inventor · disambiguated record
Hsu Ting
Also filed as: TING HSU-MING · Ting Hsu
13 granted patents·4 pending applications·21 citations·filing 2015–2023
86Inventor score
Top patents by PatentIndex Score
17 records- 0192US11648749B2Rigid board plastic flooring and its production methodDARDE FLOORING DEV JIANGSU CO LTD·Filed 2021·Granted May 16, 2023·7 cites·3 claims
- 0289US9646889B1Method of removing a hard mask layer on a gate structure while forming a protective layer on the surface of a substrateUNITED MICROELECTRONICS CORP·Filed 2016·Granted May 9, 2017·5 cites·11 claims
- 0384US10079143B2Method of forming semiconductor device having wick structureUNITED MICROELECTRONICS CORP·Filed 2017·Granted Sep 18, 2018·3 cites·10 claims
- 0478US9728397B1Semiconductor device having the insulating layers cover a bottom portion of the fin shaped structureUNITED MICROELECTRONICS CORP·Filed 2016·Granted Aug 8, 2017·2 cites·7 claims
- 0576US9793105B1Fabricating method of fin field effect transistor (FinFET)UNITED MICROELECTRONICS CORP·Filed 2016·Granted Oct 17, 2017·2 cites·20 claims
- 0675US10366991B1Semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jul 30, 2019·2 cites·22 claims
- 0769US11762293B2Fabricating method of reducing photoresist footingUNITED MICROELECTRONICS CORP·Filed 2021·Granted Sep 19, 2023·0 cites·11 claims
- 0867US2019283364A1Rigid board plastic flooring and its production methodDARDE FLOORING DEV JIANGSU CO LTD·Filed 2019·Application pending·0 cites
- 0956US2017144409A1Rigid board plastic flooring and its production methodDARDE FLOORING DEV (JIANGSU) CO LTD·Filed 2016·Application pending·0 cites
- 1056US2024234505A1Semiconductor device and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 1155US10505041B2Semiconductor device having epitaxial layer with planar surface and protrusionsUNITED MICROELECTRONICS CORP·Filed 2017·Granted Dec 10, 2019·0 cites·7 claims
- 1248US10332750B2Method for fabricating semiconductor device with strained silicon structureUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jun 25, 2019·0 cites·11 claims
- 1346US10460925B2Method for processing semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2017·Granted Oct 29, 2019·0 cites·20 claims
- 1445US10559655B1Semiconductor device and method for manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Feb 11, 2020·0 cites·18 claims
- 1541US9514993B2Method for manufacturing semiconductor devices comprising epitaxial layersUNITED MICROELECTRONICS CORP·Filed 2015·Granted Dec 6, 2016·0 cites·8 claims
- 1638US9966266B2Apparatus for semiconductor wafer treatment and semiconductor wafer treatmentUNITED MICROELECTRONICS CORP·Filed 2016·Granted May 8, 2018·0 cites·10 claims
- 1733US2018023304A1Self-adhesive floor without release of paper and its production methodDARDE FLOORING DEV (JIANGSU) CO LTD·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →