Inventor · disambiguated record
Martin Mischitz
Also filed as: MISCHITZ MARTIN
22 granted patents·1 pending application·47 citations·filing 2010–2020
92Inventor score
Files withINFINEON TECHNOLOGIES AG19INFINEON TECHNOLOGIES AUSTRIA AG2INFINEON TECHNOLOGIES AUSTRIA1MOTZ MARIO1
Top patents by PatentIndex Score
23 records- 0194US9673096B2Method for processing a semiconductor substrate and a method for processing a semiconductor waferINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jun 6, 2017·22 cites·17 claims
- 0291US9844134B2Device including a metallization layer and method of manufacturing a deviceINFINEON TECHNOLOGIES AG·Filed 2015·Granted Dec 12, 2017·10 cites·21 claims
- 0384US9929111B2Method of manufacturing a layer structure having partially sealed poresINFINEON TECHNOLOGIES AG·Filed 2017·Granted Mar 27, 2018·4 cites·20 claims
- 0483US9620466B1Method of manufacturing an electronic device having a contact pad with partially sealed poresINFINEON TECHNOLOGIES AG·Filed 2015·Granted Apr 11, 2017·4 cites·18 claims
- 0576US9190322B2Method for producing a copper layer on a semiconductor body using a printing processINFINEON TECHNOLOGIES AG·Filed 2014·Granted Nov 17, 2015·3 cites·19 claims
- 0670US10580753B2Method for manufacturing semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2017·Granted Mar 3, 2020·2 cites·16 claims
- 0763US9368436B2Source down semiconductor devices and methods of formation thereofINFINEON TECHNOLOGIES AG·Filed 2015·Granted Jun 14, 2016·1 cites·21 claims
- 0860US8704514B2Current sensor including a sintered metal layerMOTZ MARIO·Filed 2010·Granted Apr 22, 2014·1 cites·16 claims
- 0951US11488921B2Multi-chip device, method of manufacturing a multi-chip device, and method of forming a metal interconnectINFINEON TECHNOLOGIES AG·Filed 2020·Granted Nov 1, 2022·0 cites·26 claims
- 1050US10340197B2Integrated circuit substrate having configurable circuit elementsINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jul 2, 2019·0 cites·12 claims
- 1150US9786568B2Method of manufacturing an integrated circuit substrateINFINEON TECHNOLOGIES AG·Filed 2016·Granted Oct 10, 2017·0 cites·25 claims
- 1249US9911686B2Source down semiconductor devices and methods of formation thereofINFINEON TECHNOLOGIES AG·Filed 2016·Granted Mar 6, 2018·0 cites·20 claims
- 1349US9793119B2Method for structuring a substrate using a protection layer as a maskINFINEON TECHNOLOGIES AG·Filed 2016·Granted Oct 17, 2017·0 cites·17 claims
- 1449US9177790B2Inkjet printing in a peripheral region of a substrateINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Nov 3, 2015·0 cites·21 claims
- 1548US10515910B2Semiconductor device having a porous metal layer and an electronic device having the sameINFINEON TECHNOLOGIES AG·Filed 2014·Granted Dec 24, 2019·0 cites·17 claims
- 1647US9768023B1Method for structuring a substrateINFINEON TECHNOLOGIES AG·Filed 2015·Granted Sep 19, 2017·0 cites·16 claims
- 1746US11329021B2Method for fabricating a semiconductor device comprising a paste layer and semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2019·Granted May 10, 2022·0 cites·16 claims
- 1845US9640419B2Carrier system for processing semiconductor substrates, and methods thereofINFINEON TECHNOLOGIES AG·Filed 2014·Granted May 2, 2017·0 cites·21 claims
- 1942US10269635B2Integrated circuit substrate and method for manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2016·Granted Apr 23, 2019·0 cites·16 claims
- 2039US10373868B2Method of processing a porous conductive structure in connection to an electronic component on a substrateINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2016·Granted Aug 6, 2019·0 cites·20 claims
- 2138US9899277B2Integrated circuit substrate and method for manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2016·Granted Feb 20, 2018·0 cites·17 claims
- 2237US9818602B2Method of depositing a resin material on a semiconductor body with an inkjet processINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2015·Granted Nov 14, 2017·0 cites·15 claims
- 2334US2017242137A1Electronic device substrate and method for manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →