Inventor · disambiguated record
Bon Hyeok Gu
Also filed as: GU BON HYEOK
3 granted patents·1 pending application·7 citations·filing 2008–2015
60Inventor score
Top patents by PatentIndex Score
4 records- 0178US10252943B2Cement mortar additive for extrusion molding, cement mortar for extrusion molding, and extrusion-molded productLOTTE FINE CHEMICAL CO LTD·Filed 2015·Granted Apr 9, 2019·2 cites·5 claims
- 0268US7943856B2Composition for producing printed circuit board and printed circuit board using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted May 17, 2011·3 cites·14 claims
- 0358US9161443B2Wholly aromatic polyester amide copolymer resin, polymer film including the wholly aromatic polyester amide copolymer resin, flexible metal-clad laminate including the polymer film, and flexible printed circuit board including the flexible metal-clad laminateKIM YANG SEOB·Filed 2011·Granted Oct 13, 2015·2 cites·16 claims
- 0458US2009117348A1Composition for producing board and printed circuit board using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →