Inventor · disambiguated record
Yoo Seong Yang
Also filed as: YANG YOO SEONG · Yang yoo
13 granted patents·5 pending applications·31 citations·filing 2008–2023
87Inventor score
Files withSAMSUNG ELECTRONICS CO LTD5JUNG YOUNG-SUK3DOOSAN ENERBILITY CO LTD2SAMSUNG ELECTRO MECH2YANG YOO SEONG2
Top patents by PatentIndex Score
18 records- 0188US8586689B2Polymer, and composition and film including the sameJUNG YOUNG SUK·Filed 2011·Granted Nov 19, 2013·8 cites·18 claims
- 0283US8278378B2Organosilicate compound, and composition and film including the sameJUNG YOUNG-SUK·Filed 2010·Granted Oct 2, 2012·4 cites·17 claims
- 0382US8399593B2Polymer, and composition and film including the sameJUNG YOUNG-SUK·Filed 2010·Granted Mar 19, 2013·4 cites·13 claims
- 0480US8623968B2Polyimide precursor composition, method for preparing polyimide, polyimide prepared by using the method, and film including the polyimideCHO EUN SEOG·Filed 2011·Granted Jan 7, 2014·5 cites·7 claims
- 0573US9758391B2Capacitive deionization electrodes, capacitive deionization apparatuses including the same, and production methods thereofSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Sep 12, 2017·1 cites·24 claims
- 0673US8426550B2Polyamic acid, polyimide, manufacturing method thereof, and polyimide filmSOHN BYUNG-HEE·Filed 2010·Granted Apr 23, 2013·2 cites·21 claims
- 0768US7943856B2Composition for producing printed circuit board and printed circuit board using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted May 17, 2011·3 cites·14 claims
- 0864US8461662B2Carbon/epoxy resin composition, and carbon-epoxy dielectric film produced by using the sameLEE EUN-SUNG·Filed 2010·Granted Jun 11, 2013·2 cites·13 claims
- 0958US2009117348A1Composition for producing board and printed circuit board using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 1056US8304473B2Carbon/epoxy resin composition and method of producing a carbon-epoxy dielectric film using the sameYANG YOO-SEONG·Filed 2009·Granted Nov 6, 2012·2 cites·11 claims
- 1156US2010055416A1Composite and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1251US12390938B2Device and method for removing foreign object from heat transfer tubeDOOSAN ENERBILITY CO LTD·Filed 2023·Granted Aug 19, 2025·0 cites·15 claims
- 1350US10712299B2Deformation measuring apparatus and method of evaluating deformation using thereofSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jul 14, 2020·0 cites·14 claims
- 1449US2010051340A1Dielectric paste having a low dielectric loss, method of manufacture thereof and an article that uses the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 1548US2009251846A1Embedded capacitorSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1647US2012008252A1Dielectric paste having a low dielectric loss, method of manufacture thereof and an article that uses the sameYANG YOO SEONG·Filed 2011·Application pending·0 cites
- 1746US12485462B2Opening maching apparatus for heat transfer tube, method of forming opening in tube wall of heat transfer tube using same, and method of removing foreign material through same opening of same heat transfer tubeDOOSAN ENERBILITY CO LTD·Filed 2022·Granted Dec 2, 2025·0 cites·18 claims
- 1840US8936849B2Polyamide combination film prepared by using same, and display device including the filmCHO CHUNG KUN·Filed 2011·Granted Jan 20, 2015·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →