Inventor · disambiguated record
Howard S. Landis
Also filed as: LANDIS HOWARD S · LANDIS HOWARD SMITH
50 granted patents·4 pending applications·694 citations·filing 1990–2024
98Inventor score
Top patents by PatentIndex Score
54 records- 0195US5036630ARadial uniformity control of semiconductor wafer polishingIBM·Filed 1990·Granted Aug 6, 1991·107 cites·13 claims
- 0291US6495917B1Method and structure of column interconnectIBM·Filed 2000·Granted Dec 17, 2002·71 cites·13 claims
- 0388US7312141B2Shapes-based migration of aluminum designs to copper damasceneIBM·Filed 2005·Granted Dec 25, 2007·14 cites·17 claims
- 0487US9170482B2Trimming of dummy fill shapes holes to affect near-neighbor dummy fill shapes with built-in optical proximity corrections for semiconductor applicationsIBM·Filed 2014·Granted Oct 27, 2015·8 cites·13 claims
- 0587US8839177B1Method and system allowing for semiconductor design rule optimizationIBM·Filed 2013·Granted Sep 16, 2014·13 cites·20 claims
- 0687US8176447B2Formation of masks/reticles having dummy featuresKUMAR AMIT·Filed 2010·Granted May 8, 2012·5 cites·5 claims
- 0787US5292689AMethod for planarizing semiconductor structure using subminimum featuresIBM·Filed 1992·Granted Mar 8, 1994·82 cites·21 claims
- 0884US7888800B2Dummy metal fill shapes for improved reliability of hybrid oxide/low-k dielectricsIBM·Filed 2008·Granted Feb 15, 2011·9 cites·7 claims
- 0984US7250363B2Aligned dummy metal fill and hole shapesIBM·Filed 2005·Granted Jul 31, 2007·13 cites·20 claims
- 1083US6528883B1Shapes-based migration of aluminum designs to copper damasceneIBM·Filed 2000·Granted Mar 4, 2003·31 cites·3 claims
- 1182US8739078B2Near-neighbor trimming of dummy fill shapes with built-in optical proximity corrections for semiconductor applicationsLANDIS HOWARD S·Filed 2012·Granted May 27, 2014·3 cites·23 claims
- 1282US8089126B2Method and structures for improving substrate loss and linearity in SOI substratesBOTULA ALAN BERNARD·Filed 2009·Granted Jan 3, 2012·9 cites·5 claims
- 1380US7739632B2System and method of automated wire and via layout optimization descriptionIBM·Filed 2007·Granted Jun 15, 2010·11 cites·5 claims
- 1480US7491578B1Method of forming crack trapping and arrest in thin film structuresIBM·Filed 2008·Granted Feb 17, 2009·8 cites·1 claims
- 1580US5466636AMethod of forming borderless contacts using a removable mandrelIBM·Filed 1992·Granted Nov 14, 1995·63 cites·24 claims
- 1680US5453639APlanarized semiconductor structure using subminimum featuresIBM·Filed 1993·Granted Sep 26, 1995·54 cites·5 claims
- 1778US9977325B2Modifying design layer of integrated circuit (IC)IBM·Filed 2015·Granted May 22, 2018·2 cites·8 claims
- 1877US7930667B2System and method of automated wire and via layout optimization descriptionIBM·Filed 2006·Granted Apr 19, 2011·8 cites·19 claims
- 1975US8423945B2Methods and systems to meet technology pattern density requirements of semiconductor fabrication processesBICKFORD JEANNE P·Filed 2010·Granted Apr 16, 2013·7 cites·9 claims
- 2074US7573130B1Crack trapping and arrest in thin film structuresIBM·Filed 2009·Granted Aug 11, 2009·5 cites·1 claims
- 2174US6559543B1Stacked fill structures for support of dielectric layersIBM·Filed 2001·Granted May 6, 2003·18 cites·10 claims
- 2273US10254642B2Modifying design layer of integrated circuit (IC) using nested and non-nested fill objectsIBM·Filed 2018·Granted Apr 9, 2019·1 cites·12 claims
- 2373US7269818B2Circuit element function matching despite auto-generated dummy shapesIBM·Filed 2005·Granted Sep 11, 2007·5 cites·13 claims
- 2473US7015582B2Dummy metal fill shapes for improved reliability of hybrid oxide/low-k dielectricsIBM·Filed 2003·Granted Mar 21, 2006·15 cites·21 claims
- 2573US6069049AShrink-wrap collar from DRAM deep trenchesIBM·Filed 1997·Granted May 30, 2000·27 cites·11 claims
- 2669US7689961B2Increased power line noise immunity in IC using capacitor structure in fill areaIBM·Filed 2005·Granted Mar 30, 2010·4 cites·17 claims
- 2768US7721248B2Circuit element function matching despite auto-generated dummy shapesIBM·Filed 2007·Granted May 18, 2010·3 cites·6 claims
- 2867US7886240B2Modifying layout of IC based on function of interconnect and related circuit and design structureIBM·Filed 2008·Granted Feb 8, 2011·3 cites·17 claims
- 2967US6992002B2Shapes-based migration of aluminum designs to copper damascenceIBM·Filed 2002·Granted Jan 31, 2006·12 cites·3 claims
- 3065US7709300B2Structure and method for partitioned dummy fill shapes for reduced mask bias with alternating phase shift masksIBM·Filed 2006·Granted May 4, 2010·3 cites·20 claims
- 3165US7498250B2Shapes-based migration of aluminum designs to copper damasceneIBM·Filed 2007·Granted Mar 3, 2009·2 cites·13 claims
- 3264US8138607B2Metal fill structures for reducing parasitic capacitanceCOLLINS DAVID S·Filed 2009·Granted Mar 20, 2012·3 cites·20 claims
- 3363US8299775B2Current-aligned auto-generated non-equiaxial hole shape for wiringLANDIS HOWARD S·Filed 2005·Granted Oct 30, 2012·3 cites·19 claims
- 3463US7739648B2Formation of masks/reticles having dummy featuresIBM·Filed 2007·Granted Jun 15, 2010·1 cites·35 claims
- 3562US7861208B2Structure for partitioned dummy fill shapes for reduced mask bias with alternating phase shift masksIBM·Filed 2007·Granted Dec 28, 2010·2 cites·12 claims
- 3662US5539240APlanarized semiconductor structure with subminimum featuresIBM·Filed 1995·Granted Jul 23, 1996·20 cites·10 claims
- 3761US6399976B1Shrink-wrap collar for DRAM deep trenchesIBM·Filed 1995·Granted Jun 4, 2002·17 cites·10 claims
- 3860US7709967B2Shapes-based migration of aluminum designs to copper damasceneIBM·Filed 2007·Granted May 4, 2010·1 cites·20 claims
- 3960US7479701B2Dummy metal fill shapes for improved reliability of hybrid oxide/low-k dielectricsIBM·Filed 2006·Granted Jan 20, 2009·1 cites·11 claims
- 4059US7537941B2Variable overlap of dummy shapes for improved rapid thermal anneal uniformityIBM·Filed 2006·Granted May 26, 2009·1 cites·28 claims
- 4157US2025348054A1Analysis and manufacture of curved features for integrated circuitsGLOBALFOUNDRIES US INC·Filed 2024·Application pending·0 cites
- 4253US6743710B2Stacked fill structures for support of dielectric layersIBM·Filed 2003·Granted Jun 1, 2004·4 cites·20 claims
- 4350US6270353B1Low cost shallow trench isolation using non-conformal dielectric materialIBM·Filed 1999·Granted Aug 7, 2001·16 cites·20 claims
- 4450US2013181267A1Wafer fill patterns and usesIBM·Filed 2013·Application pending·0 cites
- 4546US8796133B2Optimization metallization for prevention of dielectric cracking under controlled collapse chip connectionsBONILLA GRISELDA·Filed 2012·Granted Aug 5, 2014·0 cites·24 claims
- 4646US8507346B2Method of forming a semiconductor device having a cut-way hole to expose a portion of a hardmask layerBURKHARDT MARTIN·Filed 2010·Granted Aug 13, 2013·0 cites·4 claims
- 4744US7791166B2Formation of dummy features and inductors in semiconductor fabricationIBM·Filed 2007·Granted Sep 7, 2010·0 cites·11 claims
- 4843US8288821B2SOI (silicon on insulator) substrate improvementsBOTULA ALAN BERNARD·Filed 2009·Granted Oct 16, 2012·0 cites·20 claims
- 4942US7858269B2Structure and method for sub-resolution dummy clear shapes for improved gate dimensional controlIBM·Filed 2007·Granted Dec 28, 2010·0 cites·20 claims
- 5041US2007281218A1Dummy Phase Shapes To Reduce Sensitivity Of Critical Gates To Regions Of High Pattern DensityLANDIS HOWARD S·Filed 2006·Application pending·0 cites
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