Inventor · disambiguated record
Yeochan Ko
Also filed as: KO YEOCHAN
4 granted patents·40 citations·filing 2015–2020
76Inventor score
Files withSTATS CHIPPAC PTE LTD4
Top patents by PatentIndex Score
4 records- 0197US10797024B2System-in-package with double-sided moldingSTATS CHIPPAC PTE LTD·Filed 2020·Granted Oct 6, 2020·6 cites·25 claims
- 0297US10636765B2System-in-package with double-sided moldingSTATS CHIPPAC PTE LTD·Filed 2017·Granted Apr 28, 2020·24 cites·21 claims
- 0390US11670618B2System-in-package with double-sided moldingSTATS CHIPPAC PTE LTD·Filed 2020·Granted Jun 6, 2023·2 cites·25 claims
- 0488US9859200B2Integrated circuit packaging system with interposer support structure mechanism and method of manufacture thereofSTATS CHIPPAC PTE LTD·Filed 2015·Granted Jan 2, 2018·8 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →