Inventor · disambiguated record
Heiko Braml
Also filed as: BRAML HEIKO
4 granted patents·2 pending applications·1 citations·filing 2008–2025
56Inventor score
Files withGOEBL CHRISTIAN2GÖBL CHRISTIAN1SEMIKRON DANFOSS ELEKTRONIK GMBH & CO KG1SEMIKRON ELEKTRONIK GMBH1SEMIKRON ELEKTRONIK GMBH & CO KG1
Top patents by PatentIndex Score
6 records- 0150US8564126B2Semiconductor arrangementGOEBL CHRISTIAN·Filed 2010·Granted Oct 22, 2013·1 cites·18 claims
- 0242US10603741B2Apparatus for the material-bonded connection of connection partners of a power-electronics componentSEMIKRON ELEKTRONIK GMBH & CO KG·Filed 2016·Granted Mar 31, 2020·0 cites·17 claims
- 0342US2025275058A1Arrangement having a printed circuit board and a power electronics component, and method of productionSEMIKRON DANFOSS ELEKTRONIK GMBH & CO KG·Filed 2025·Application pending·0 cites
- 0441US9768036B2Power semiconductor substrates with metal contact layer and method of manufacture thereofGÖBL CHRISTIAN·Filed 2008·Granted Sep 19, 2017·0 cites·10 claims
- 0541US2008292874A1Sintered power semiconductor substrate and method of producing the substrateSEMIKRON ELEKTRONIK GMBH·Filed 2008·Application pending·0 cites
- 0639US8324717B2Power semiconductor module with a hermetically tight circuit arrangement and method for producing such a moduleGOEBL CHRISTIAN·Filed 2009·Granted Dec 4, 2012·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →