Inventor · disambiguated record
Min-Lung Huang
Also filed as: HUANG MIN-LUNG
73 granted patents·37 pending applications·959 citations·filing 2000–2025
99Inventor score
Top patents by PatentIndex Score
110 records- 0198US6452270B1Semiconductor device having bump electrodeADVANCED SEMICONDUCTOR ENG·Filed 2001·Granted Sep 17, 2002·196 cites·9 claims
- 0296US10388598B2Interposer, semiconductor package structure, and semiconductor processADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Aug 20, 2019·10 cites·19 claims
- 0395US7741152B2Three-dimensional package and method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Jun 22, 2010·44 cites·11 claims
- 0494US7528053B2Three-dimensional package and method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted May 5, 2009·31 cites·22 claims
- 0593US7642132B2Three-dimensional package and method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Jan 5, 2010·24 cites·20 claims
- 0693US7049705B2Chip structureADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted May 23, 2006·82 cites·11 claims
- 0792US8193647B2Semiconductor device package with an alignment markHSIEH CHUEHAN·Filed 2010·Granted Jun 5, 2012·46 cites·17 claims
- 0891US9852971B1Interposer, semiconductor package structure, and semiconductor processADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Dec 26, 2017·5 cites·19 claims
- 0991US7253519B2Chip packaging structure having redistribution layer with recessADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Aug 7, 2007·57 cites·18 claims
- 1090US8358001B2Semiconductor device packages, redistribution structures, and manufacturing methods thereofADVANCED SEMICONDUCTOR ENG·Filed 2009·Granted Jan 22, 2013·23 cites·20 claims
- 1190US7446404B2Three-dimensional package and method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Nov 4, 2008·18 cites·8 claims
- 1289US9406552B2Semiconductor device having conductive via and manufacturing processADVANCED SEMICONDUCTOR ENG·Filed 2012·Granted Aug 2, 2016·9 cites·20 claims
- 1387US6564449B1Method of making wire connection in semiconductor deviceADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted May 20, 2003·50 cites·21 claims
- 1485US10939561B1Wiring structure and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Mar 2, 2021·3 cites·21 claims
- 1581US6664128B2Bump fabrication processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Dec 16, 2003·25 cites·15 claims
- 1680US10566279B2Package device, semiconductor device, and method for manufacturing the package deviceADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Feb 18, 2020·4 cites·20 claims
- 1780US6930389B2Under bump metallization structure of a semiconductor waferADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Aug 16, 2005·27 cites·10 claims
- 1878US8288853B2Three-dimensional package and method of making the sameHUANG MIN-LUNG·Filed 2009·Granted Oct 16, 2012·9 cites·10 claims
- 1977US12249583B2Package structure, assembly structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Mar 11, 2025·0 cites·18 claims
- 2077US6861346B2Solder ball fabricating processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Mar 1, 2005·21 cites·20 claims
- 2175US7271498B2Bump electrodes having multiple under ball metallurgy (UBM) layersADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Sep 18, 2007·21 cites·14 claims
- 2275US7250362B2Solder bump structure and method for forming the sameADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Jul 31, 2007·21 cites·15 claims
- 2375US6673711B2Solder ball fabricating processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jan 6, 2004·19 cites·21 claims
- 2474US2025210544A1Package structure, assembly structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 2572US12040312B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Jul 16, 2024·0 cites·6 claims
- 2672US7420274B2Method for forming a redistribution layer in a wafer structureADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Sep 2, 2008·4 cites·4 claims
- 2772US6617237B1Lead-free bump fabrication processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Sep 9, 2003·19 cites·25 claims
- 2871US6827252B2Bump manufacturing methodADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Dec 7, 2004·18 cites·39 claims
- 2970US6930031B2Bumping processADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Aug 16, 2005·16 cites·14 claims
- 3070US6921716B2Wafer bumping processADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Jul 26, 2005·16 cites·21 claims
- 3169US6846719B2Process for fabricating wafer bumpsADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jan 25, 2005·16 cites·18 claims
- 3267US10663746B2Collimator, optical device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted May 26, 2020·1 cites·8 claims
- 3366US6916732B2Method of forming bumpsADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jul 12, 2005·11 cites·21 claims
- 3464US11428946B2Method for manufacturing a through substrate viaADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Aug 30, 2022·0 cites·10 claims
- 3564US7030492B2Under bump metallurgic layerADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Apr 18, 2006·11 cites·8 claims
- 3663US9960102B2Semiconductor devices and methods of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted May 1, 2018·1 cites·20 claims
- 3763US7358176B2Screen printing method of forming conductive bumpsADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Apr 15, 2008·2 cites·15 claims
- 3862US7221052B2Chip scale package with micro antenna and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted May 22, 2007·2 cites·8 claims
- 3962US7189646B2Method of enhancing the adhesion between photoresist layer and substrate and bumping processADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Mar 13, 2007·10 cites·8 claims
- 4061US7151012B2Redistribution layer of wafer and the fabricating method thereofADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Dec 19, 2006·2 cites·11 claims
- 4161US6989326B2Bump manufacturing methodADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Jan 24, 2006·10 cites·24 claims
- 4261US2025372584A1Electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 4360US6732912B2Solder ball attaching processADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted May 11, 2004·8 cites·29 claims
- 4459US11728282B2Package structure, assembly structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Aug 15, 2023·0 cites·15 claims
- 4559US2025374429A1Electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 4658US11355426B2Wiring structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Jun 7, 2022·0 cites·17 claims
- 4757US7375020B2Method of forming bumpsADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted May 20, 2008·6 cites·10 claims
- 4856US11508634B2Semiconductor package structure, electronic device, and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Nov 22, 2022·0 cites·18 claims
- 4956US11222870B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Jan 11, 2022·0 cites·20 claims
- 5056US6723630B2Solder ball fabrication processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Apr 20, 2004·7 cites·19 claims
Showing the top 50 of 110 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →