Inventor · disambiguated record
Daniel B. Dow
Also filed as: DOW DANIEL B
7 granted patents·1 pending application·537 citations·filing 1998–2004
88Inventor score
Technology areasH10P
Files withMICRON TECHNOLOGY INC7
Top patents by PatentIndex Score
8 records- 0195US6319420B1Method and apparatus for electrically endpointing a chemical-mechanical planarization processMICRON TECHNOLOGY INC·Filed 2000·Granted Nov 20, 2001·123 cites·50 claims
- 0295US6190494B1Method and apparatus for electrically endpointing a chemical-mechanical planarization processMICRON TECHNOLOGY INC·Filed 1998·Granted Feb 20, 2001·247 cites·30 claims
- 0390US6358129B2Backing members and planarizing machines for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods of making and using such backing membersMICRON TECHNOLOGY INC·Filed 1998·Granted Mar 19, 2002·131 cites·59 claims
- 0465US6153532AMethods and apparatuses for removing material from discrete areas on a semiconductor waferMICRON TECHNOLOGY INC·Filed 1998·Granted Nov 28, 2000·23 cites·50 claims
- 0563US6737356B1Method of fabricating a semiconductor work objectMICRON TECHNOLOGY INC·Filed 2000·Granted May 18, 2004·8 cites·62 claims
- 0659US6375792B1Methods and apparatuses for removing material from discrete areas on a semiconductor waferMICRON TECHNOLOGY INC·Filed 2000·Granted Apr 23, 2002·5 cites·16 claims
- 0740US6376390B1Methods and apparatuses for removing material from discrete areas on a semiconductor waferMICRON TECHNOLOGY INC·Filed 2000·Granted Apr 23, 2002·0 cites·19 claims
- 0840US2004214436A1Method of fabricating a semiconductor work objectFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →