Inventor · disambiguated record
Hsin-Hung Liao
Also filed as: LIAO HSIN-HUNG
33 granted patents·3 pending applications·93 citations·filing 2008–2020
96Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD26TAIWAN SEMICONDUCTOR MFG4UNIV NAT TAIWAN2HWANG CHIEN LING1LIN YEONG-JYH1
Top patents by PatentIndex Score
36 records- 0197US9093337B2Methods for controlling warpage in packagingTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jul 28, 2015·27 cites·20 claims
- 0295US10157881B2Methods for controlling warpage in packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 18, 2018·9 cites·20 claims
- 0395US9984960B2Integrated fan-out package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 29, 2018·14 cites·20 claims
- 0492US9870997B2Integrated fan-out package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 16, 2018·6 cites·20 claims
- 0591US9484226B2Methods for controlling warpage in packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 1, 2016·5 cites·20 claims
- 0690US10510712B2Methods for controlling warpage in packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·3 cites·20 claims
- 0790US10056285B2Semiconductor wafer device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 21, 2018·4 cites·20 claims
- 0888US10269582B2Package structure, fan-out package structure and method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 23, 2019·4 cites·20 claims
- 0987US9768142B2Mechanisms for forming bonding structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 19, 2017·7 cites·20 claims
- 1082US8540136B1Methods for stud bump formation and apparatus for performing the sameLIN YEONG-JYH·Filed 2012·Granted Sep 24, 2013·6 cites·19 claims
- 1180US10276509B2Integrated fan-out packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·2 cites·20 claims
- 1279US9870929B2Package structure, fan-out package structure and method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 16, 2018·2 cites·20 claims
- 1374US9498851B2Methods for forming apparatus for stud bump formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 22, 2016·2 cites·20 claims
- 1473US9812346B2Semiconductor wafer device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 7, 2017·1 cites·20 claims
- 1570US11721555B2Method and system for thinning wafer thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 8, 2023·0 cites·20 claims
- 1670US11532551B2Semiconductor package with chamfered semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 20, 2022·1 cites·20 claims
- 1769US11139177B2Method of fabricating semiconductor package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 5, 2021·0 cites·20 claims
- 1868US11094561B2Semiconductor package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 17, 2021·0 cites·20 claims
- 1963US10770331B2Semiconductor wafer device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 8, 2020·0 cites·20 claims
- 2062US11233032B2Mechanisms for forming bonding structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 25, 2022·0 cites·20 claims
- 2159US9236351B2Semiconductor wafer deviceTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 12, 2016·0 cites·20 claims
- 2258US11101232B2Conductive micro pinTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 24, 2021·0 cites·20 claims
- 2357US9129899B2Method and system for thinning wafer thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 8, 2015·0 cites·16 claims
- 2456US8936730B2Methods for forming apparatus for stud bump formationTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 20, 2015·0 cites·18 claims
- 2555US10727074B2Method and system for thinning wafer thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jul 28, 2020·0 cites·20 claims
- 2655US10504870B2Mechanisms for forming bonding structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 10, 2019·0 cites·19 claims
- 2754US2010086416A1Thermo-pneumatic peristaltic pumpUNIV NAT TAIWAN·Filed 2008·Application pending·0 cites
- 2853US10679866B2Interconnect structure for semiconductor package and method of fabricating the interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jun 9, 2020·0 cites·19 claims
- 2950US10115690B2Method of manufacturing micro pins and isolated conductive micro pinTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 30, 2018·0 cites·20 claims
- 3048US10867890B2Mutli-chip package with encapsulated conductor viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·0 cites·20 claims
- 3148US9085049B2Method and system for manufacturing semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Jul 21, 2015·0 cites·20 claims
- 3247US2013274665A1Drug delivery chip and fabricating method thereofUNIV NAT TAIWAN·Filed 2013·Application pending·0 cites
- 3342US8460564B2Drug delivery chip and fabricating method thereofLU SHEY-SHI·Filed 2010·Granted Jun 11, 2013·0 cites·7 claims
- 3440US10438922B2Method and system for mounting components in semiconductor fabrication processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 8, 2019·0 cites·20 claims
- 3540US2013273717A1Apparatus and Method for the Singulation of a Semiconductor WaferHWANG CHIEN LING·Filed 2012·Application pending·0 cites
- 3637US8111439B2Optical switch and optical switch device having the sameYANG YAO-JOE·Filed 2009·Granted Feb 7, 2012·0 cites·21 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →